Patents by Inventor Susumu Tsumura

Susumu Tsumura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacturing semiconductor device with ceramic multilayer board
    Patent number: 6890800
    Abstract: One side of a ceramic multilayer board is attached to a resin film with adhesive, the resin film is mounted on a mold for resin sealing having a cavity provided in desired position, the position of the board is controlled by pressing against a portion of the resin film by a portion of the mold for sealing, and thereafter sealing is conducted by filling an epoxy resin into the cavity. The thus prepared semiconductor device has a rear face on which electrodes for connecting to outside are exposed, and the sealing resin is formed so as to be flush with respect to the rear face of the board, surround the periphery of the board, and form a cross section in a rectangular shape. With this configuration, the semiconductor device free from a crack can be sealed with resin.
    Type: Grant
    Filed: July 29, 2002
    Date of Patent: May 10, 2005
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hideki Takehara, Noriyuki Yoshikawa, Susumu Tsumura
  • Semiconductor device and method for manufacturing the same
    Publication number: 20030111725
    Abstract: One side of a ceramic multilayer board is attached to a resin film with adhesive, the resin film is mounted on a mold for resin sealing having a cavity provided in desired position, the position of the board is controlled by pressing against a portion of the resin film by a portion of the mold for sealing, and thereafter sealing is conducted by filling an epoxy resin into the cavity. The thus prepared semiconductor device has a rear face on which electrodes for connecting to outside are exposed, and the sealing resin is formed so as to be flush with respect to the rear face of the board, surround the periphery of the board, and form a cross section in a rectangular shape. With this configuration, the semiconductor device free from a crack can be sealed with resin.
    Type: Application
    Filed: July 29, 2002
    Publication date: June 19, 2003
    Applicant: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hideki Takehara, Noriyuki Yoshikawa, Susumu Tsumura