Patents by Inventor Susumu Yamamoto

Susumu Yamamoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090274307
    Abstract: Disclosed is an audio system including a group of loudspeakers that form a sound field by delivering into a single space sound signals passed through respective ones of a plurality of sound signal channels. This audio system is comprised of two characteristic-variable equalizers that are cascaded to each other to constitute a part of the sound signal channels; a sound field characteristics detecting part for supplying test signals through the sound signal channels and detecting sound pressure in the sound field and thereby obtaining a sound pressure signal; and a characteristics adjusting part for adjusting, based on the sound pressure signal, equalizing characteristics of the characteristic-variable equalizers individually and with respect to each of the sound signal channels. The sound field characteristics detecting part selectively generates test signals of different bands.
    Type: Application
    Filed: July 4, 2006
    Publication date: November 5, 2009
    Applicant: PIONEER CORPORATION
    Inventors: Hajime Yoshino, Susumu Yamamoto
  • Publication number: 20090259072
    Abstract: An iodide compound is adsorbed and removed from an organic acid containing the iodide compound as an impurity by passing the organic acid through a packed bed of a cation-exchange resin having silver ion carried thereon at 50° C. or lower. The cation-exchange resin is a macroporous-type resin with an average particle size of 0.3 to 0.6 mm and an average pore size of 15 to 28 nm, and silver ion substitutes for 40 to 60% of the active site.
    Type: Application
    Filed: June 29, 2007
    Publication date: October 15, 2009
    Applicant: CHIYODA CORPORATION
    Inventors: Yoichi Umehara, Takeshi Minami, Susumu Yamamoto, Haruto Kobayashi, Yasuo Hosono
  • Publication number: 20090074242
    Abstract: A digital watermark embedding apparatus for embedding embedding information, as digital watermark, into an input signal having dimensions equal to or greater than N (N is an integer equal to or greater than 2) and a digital watermark detection apparatus for detecting the digital watermark are disclosed. The digital watermark embedding apparatus generates an embedding sequence based on embedding information, generates a N?1-dimensional pattern based on the embedding sequence, generates N-dimensional embedding pattern by modulating a periodic signal according to a value on the N?1-dimensional pattern, and superimposing the embedding pattern in the input signal and outputs it.
    Type: Application
    Filed: March 1, 2007
    Publication date: March 19, 2009
    Applicant: Nippon Telegraph and Telephone Corp.
    Inventors: Susumu Yamamoto, Takao Nakamura
  • Patent number: 7494931
    Abstract: A method for fabricating a semiconductor device includes forming a copper film above a surface of a substrate, forming on a polishing pad a material which contains copper, wherein said copper does not derive from said copper film, and after having formed the copper-containing material on said polishing pad, polishing said copper film by use of said polishing pad.
    Type: Grant
    Filed: September 26, 2006
    Date of Patent: February 24, 2009
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Dai Fukushima, Gaku Minamihaba, Hiroyuki Yano, Nobuyuki Kurashima, Susumu Yamamoto
  • Patent number: 7419910
    Abstract: Disclosed is a CMP slurry comprising a Cu oxidizing agent, a complexing agent for forming a Cu organic complex, a surfactant, an inorganic particle, and a resin particle containing polystyrene, having on the surface thereof a functional group of the same kind of polarity as that of the inorganic particle and having an average particle diameter of less than 100 nm, the resin particle being incorporated at a concentration of less than 1% by weight.
    Type: Grant
    Filed: September 2, 2004
    Date of Patent: September 2, 2008
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Gaku Minamihaba, Dai Fukushima, Susumu Yamamoto, Hiroyuki Yano
  • Publication number: 20080124927
    Abstract: Disclosed is a semiconductor device comprising a semiconductor substrate, a first insulating film formed above the semiconductor substrate, Cu wiring buried in the first insulating film, a second insulating film formed above the Cu wiring, and a discontinuous film made of at least one metal selected from the group consisting of Ti, Al, W, Pd, Sn, Ni, Mg and Zn, or a metal oxide thereof and interposed at an interface between the Cu wiring and the second insulating film.
    Type: Application
    Filed: October 31, 2007
    Publication date: May 29, 2008
    Inventors: Gaku Minamihaba, Hiroyuki Yano, Nobuyuki Kurashima, Susumu Yamamoto
  • Patent number: 7378428
    Abstract: A nitrogen-containing bicyclic compound of formula (I) or a pharmaceutically acceptable salt thereof (wherein the symbols have the same meanings as described in the specification). The compound of formula (I) has an inhibitory activity against PDE7 and it is useful for the prevention and/or treatment of various diseases, i.e. autoimmune diseases (ulcerative colitis, Crohn's disease, rheumatism, psoriasis, multiple sclerosis, collagenosis, etc.), inflammatory diseases (obstructive pulmonary disease, sepsis, pancreatitis, sarcoidosis, nephritis, hepatitis, enteritis, etc.), allergic diseases (asthma, allergic rhinitis, allergic conjunctivitis, seasonal conjunctivitis, atopic dermatitis, etc.), rejection of organ transplants, serious graft versus host disease (GVHD), diabetic disease, osteoporosis, bone fracture, restenosis, atherosclerosis, obesity, ischemic reperfusion injury, depression, Parkinson's disease, dementia, leukemia, etc.
    Type: Grant
    Filed: January 30, 2003
    Date of Patent: May 27, 2008
    Assignee: Ono Pharmaceutical Co., Ltd.
    Inventors: Akira Ohhata, Yoshikazu Takaoka, Mikio Ogawa, Hisao Nakai, Susumu Yamamoto, Hiroshi Ochiai
  • Publication number: 20080089552
    Abstract: A digital watermark embedding method of the present invention includes: a step of sequentially obtaining each frame image of the moving image data and frame display time; a step of generating a watermark pattern using watermark information, the frame display time and watermark pattern switching information; a step of superimposing the watermark pattern onto the frame image, and combining watermark embedded frame images obtained by sequentially repeating the processes to generate watermark embedded moving image data. A digital watermark detection method includes a step of sequentially obtaining a frame image; a step of generating a difference image between the currently obtained frame image and a previously obtained frame image; and a step of performing digital watermark detection from the difference image to output digital watermark detection status, and when digital watermark detection process is continued, obtaining a new frame again to repeat the above processes.
    Type: Application
    Filed: July 31, 2006
    Publication date: April 17, 2008
    Applicant: NIPPON TELEGRAPH AND TELEPHONE CORPORATION
    Inventors: Takao Nakamura, Susumu Yamamoto, Ryo Kitahara, Takashi Miyatake, Atushi Katayama, Hisato Miyachi
  • Patent number: 7307023
    Abstract: A method for polishing a Cu film comprises contacting a Cu film formed above a semiconductor substrate with a polishing pad attached to a turntable, and supplying a first chemical liquid which promotes the polishing of the Cu film and a second chemical liquid which contains a surfactant, to the polishing pad while the turntable being rotated, thereby polishing the Cu film, while monitoring at least one of a table current of the turntable and a surface temperature of the polishing pad to detect a change in at least one of the table current of the turntable and the surface temperature of the polishing pad. The supply of the second chemical liquid is controlled in conformity with the change.
    Type: Grant
    Filed: October 2, 2006
    Date of Patent: December 11, 2007
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Dai Fukushima, Gaku Minamihaba, Hiroyuki Yano, Susumu Yamamoto
  • Patent number: 7307344
    Abstract: Disclosed is a semiconductor device comprising a semiconductor substrate, a first insulating film formed above the semiconductor substrate, Cu wiring buried in the first insulating film, a second insulating film formed above the Cu wiring, and a discontinuous film made of at least one metal selected from the group consisting of Ti, Al, W, Pd, Sn, Ni, Mg and Zn, or a metal oxide thereof and interposed at an interface between the Cu wiring and the second insulating film.
    Type: Grant
    Filed: September 30, 2005
    Date of Patent: December 11, 2007
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Gaku Minamihaba, Hiroyuki Yano, Nobuyuki Kurashima, Susumu Yamamoto
  • Publication number: 20070232068
    Abstract: A slurry for touch-up CMP is provided, which includes water, colloidal silica having an average primary particle diameter of 5 to 60 nm, unsintered cerium oxide having an average primary particle diameter of 5 to 60 nm, a multivalent organic acid containing no nitrogen atoms, and a nitrogen-containing heterocyclic compound. The slurry has a pH of 8 to 12.
    Type: Application
    Filed: March 13, 2007
    Publication date: October 4, 2007
    Inventors: Gaku Minamihaba, Nobuyuki Kurashima, Dai Fukushima, Takatoshi Ono, Susumu Yamamoto, Hiroyuki Yano
  • Patent number: 7268506
    Abstract: The power window system moves a window glass in opening and closing directions in response to operation of an opening and closing instruction switch. The power window system includes a measurement device for obtaining an open degree of the window glass and a control device for controlling movement of the window glass in response to operation of the switch. The control device moves the window glass in the closing direction when an open degree obtained by the measurement device is not less than a predetermined degree and in the opening direction when the open degree is less than the predetermined degree.
    Type: Grant
    Filed: June 6, 2005
    Date of Patent: September 11, 2007
    Assignee: Yazaki Corporation
    Inventors: Satoshi Nakagawa, Yoshimitsu Maejima, Yasuyuki Mochizuki, Katsuyuki Iwasaki, Susumu Yamamoto
  • Publication number: 20070169140
    Abstract: A disk reproducing apparatus with improved quality is provided which has a clamper and a clamper plate. By providing the clamp plate with connection portions radially extending from a radially inner peripheral portion toward radially outer peripheral portion of the clamp plate, the axial displacement relative to a clamp holder can be increased as compared to that in the existing structure. Moreover, by disposing the clamper on the radially inner peripheral portion of the clamp plate so as to be elastically deformable, the spacing in clamping can be increased to a drive part.
    Type: Application
    Filed: January 16, 2007
    Publication date: July 19, 2007
    Inventors: Kouichi Ogawa, Susumu Yamamoto, Takayuki Umemoto, Takeshi Fujii
  • Publication number: 20070132459
    Abstract: A control circuit 52 makes the pulse oscillation circuit 51 output pulse signals of frequency 2.5 Hz and 4.5 Hz. The control circuit 52 calculates a difference between outputs of a low pass filter 53 at 2.5 Hz and at 4.5 Hz. The control circuit 52 detects a state of the insulation resistance detector 50 based on the difference.
    Type: Application
    Filed: December 5, 2006
    Publication date: June 14, 2007
    Applicant: YAZAKI CORPORATION
    Inventors: Susumu Yamamoto, Satoshi Ishikawa
  • Publication number: 20070128873
    Abstract: An aqueous dispersion for chemical mechanical polishing is provided, which includes water and a resin particle. The resin particles accompany with a projection having a curvature radius ranging from 10 nm to 1.65 ?m on a surface. The maximum length of the resin particles is not more than 5 ?m and is 2.5 to 25 times as large as the curvature radius.
    Type: Application
    Filed: November 17, 2006
    Publication date: June 7, 2007
    Inventors: Gaku MINAMIHABA, Nobuyuki Kurashima, Dai Fukushima, Yukiteru Matsui, Susumu Yamamoto, Hiroyuki Yano
  • Publication number: 20070093064
    Abstract: A method for polishing a Cu film comprises contacting a Cu film formed above a semiconductor substrate with a polishing pad attached to a turntable, and supplying a first chemical liquid which promotes the polishing of the Cu film and a second chemical liquid which contains a surfactant, to the polishing pad while the turntable being rotated, thereby polishing the Cu film, while monitoring at least one of a table current of the turntable and a surface temperature of the polishing pad to detect a change in at least one of the table current of the turntable and the surface temperature of the polishing pad. The supply of the second chemical liquid is controlled in conformity with the change.
    Type: Application
    Filed: October 2, 2006
    Publication date: April 26, 2007
    Inventors: Dai Fukushima, Gaku Minamihaba, Hiroyuki Yano, Susumu Yamamoto
  • Publication number: 20070049180
    Abstract: An aqueous dispersion for chemical mechanical polishing contains water, a polyvinylpyrrolidone having a weight-average molecular weight exceeding 200,000, an oxidant, a protective film-forming agent and abrasive grains, the protective film-forming agent containing a first metal compound-forming agent which forms a water-insoluble metal compound, and a second metal compound-forming agent which forms a water-soluble metal compound. The aqueous dispersion is capable of uniformly and stably polishing a metal film at low friction without causing defects in a metal film and an insulating film.
    Type: Application
    Filed: August 24, 2006
    Publication date: March 1, 2007
    Applicants: JSR Corporation, KABUSHIKI KAISHA TOSHIBA
    Inventors: Hirotaka Shida, Akihiro Takemura, Masayuki Hattori, Gaku Minamihaba, Dai Fukushima, Nobuyuki Kurashima, Susumu Yamamoto, Yoshikuni Tateyama, Hiroyuki Yano
  • Publication number: 20060243702
    Abstract: A CMP slurry for metallic film is provided, which includes water, 0.01 to 0.3 wt %, based on a total quantity of the slurry, of polyvinylpyrrolidone having a weight average molecular weight of not less than 20,000, an oxidizing agent, a protective film-forming agent containing a first complexing agent for forming a water-insoluble complex and a second complexing agent for forming a water-soluble complex, and colloidal silica having a primary particle diameter ranging from 5 to 50 nm.
    Type: Application
    Filed: January 27, 2006
    Publication date: November 2, 2006
    Inventors: Gaku Minamihaba, Dai Fukushima, Nobuyuki Kurashima, Susumu Yamamoto, Hiroyuki Yano
  • Patent number: 7091681
    Abstract: A drive circuit for a brushless DC fan motor for rotating a rotor (permanent magnet) by a rotating magnetic field produced by turning on/off the flow of electric current to field coils by a signal to control terminals of switch elements in which switch sections are each connected in series with the field coils. When connecting capacitors for absorbing a current spike in parallel with the switch sections of the switch elements, resistors are each connected between the field coil and switch section, through which the capacitors are connected in parallel with the switch sections. A discharge current of the capacitors which absorbed a current spike when turning on the switch elements is passed via the resistors, thereby eliminating a current spike.
    Type: Grant
    Filed: April 7, 2004
    Date of Patent: August 15, 2006
    Assignee: Minebea Co., Ltd.
    Inventors: Junnan Xi, Mitsuo Konno, Susumu Yamamoto
  • Publication number: 20060131751
    Abstract: Disclosed is a semiconductor device comprising a semiconductor substrate, a first insulating film formed above the semiconductor substrate, Cu wiring buried in the first insulating film, a second insulating film formed above the Cu wiring, and a discontinuous film made of at least one metal selected from the group consisting of Ti, Al, W, Pd, Sn, Ni, Mg and Zn, or a metal oxide thereof and interposed at an interface between the Cu wiring and the second insulating film.
    Type: Application
    Filed: September 30, 2005
    Publication date: June 22, 2006
    Inventors: Gaku Minamihaba, Hiroyuki Yano, Nobuyuki Kurashima, Susumu Yamamoto