Patents by Inventor Suwanchai Kongdum

Suwanchai Kongdum has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • System for providing an energy assisted magnetic recording head having a leading face-mounted laser
    Patent number: 8665690
    Abstract: A system for providing energy assisted magnetic recording (EAMR) heads using a substrate is described. The substrate has front and back sides and apertures therein. The apertures are through-holes between the front and back sides of the substrate. The system includes providing a transmission medium in the apertures and fabricating EAMR transducers on the front side of the substrate. The EAMR transducers correspond to the apertures and the EAMR heads. The system also includes electrically insulating the back side of the substrate. The back side of the substrate is also prepared for mounting of the lasers. The lasers then are coupled the back side of the substrate. The lasers correspond to the EAMR heads and are configured to provide light through the apertures to the EAMR transducers. The system also includes separating the substrate into the EAMR heads.
    Type: Grant
    Filed: April 8, 2013
    Date of Patent: March 4, 2014
    Assignee: Western Digital (Fremont), LLC
    Inventors: Mark D. Moravec, Suwanchai Kongdum, Kittikom Nontprasat
  • Method for providing a plurality of energy assisted magnetic recording EAMR heads
    Patent number: 8418353
    Abstract: A method for providing energy assisted magnetic recording (EAMR) heads using a substrate are described. The substrate has front and back sides and apertures therein. The apertures are through-holes between the front and back sides of the substrate. The method includes providing a transmission medium in the apertures and fabricating EAMR transducers on the front side of the substrate. The EAMR transducers correspond to the apertures and the EAMR heads. The method also includes electrically insulating the back side of the substrate. The back side of the substrate is also prepared for mounting of the lasers. The lasers then are coupled the back side of the substrate. The lasers correspond to the EAMR heads and are configured to provide light through the apertures to the EAMR transducers. The method also includes separating the substrate into the EAMR heads.
    Type: Grant
    Filed: December 23, 2009
    Date of Patent: April 16, 2013
    Assignee: Western Digital (Fremont), LLC
    Inventors: Mark Moravec, Suwanchai Kongdum, Anucha Nontprasat