Patents by Inventor Suxin QIAN

Suxin QIAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10823465
    Abstract: A system for heating/cooling includes a plurality of thermoelastic modules. Each of the modules includes one or more structures formed of shape memory alloy, which converts from austenite to martensite upon application of a first stress and release latent heat from the conversion. During a first part of a heating/cooling cycle, a first module is stressed to cause conversion. The latent heat released from the first module is rejected to a heat sink while a second unstressed module absorbs heat from a heat source. During a second part of the heating/cooling cycle, the first and second modules are connected together to transfer heat therebetween for heat recovery. The cycle can be repeated indefinitely with the first and second modules alternating roles. Structures of the thermoelastic cooling material and specific applications thereof are also disclosed.
    Type: Grant
    Filed: June 2, 2018
    Date of Patent: November 3, 2020
    Assignee: University of Maryland, College Park
    Inventors: K. Reinhard Radermacher, Ichiro Takeuchi, Yunho Hwang, Yiming Wu, Suxin Qian, Jiazhen Ling
  • Publication number: 20180283742
    Abstract: A system for heating/cooling includes a plurality of thermoelastic modules. Each of the modules includes one or more structures formed of shape memory alloy, which converts from austenite to martensite upon application of a first stress and release latent heat from the conversion. During a first part of a heating/cooling cycle, a first module is stressed to cause conversion. The latent heat released from the first module is rejected to a heat sink while a second unstressed module absorbs heat from a heat source. During a second part of the heating/cooling cycle, the first and second modules are connected together to transfer heat therebetween for heat recovery. The cycle can be repeated indefinitely with the first and second modules alternating roles. Structures of the thermoelastic cooling material and specific applications thereof are also disclosed.
    Type: Application
    Filed: June 2, 2018
    Publication date: October 4, 2018
    Inventors: Reinhard K. RADERMACHER, Ichiro TAKEUCHI, Yunho HWANG, Yiming WU, Suxin QIAN, Jiazhen LING
  • Patent number: 10018385
    Abstract: A system for heating/cooling includes a plurality of thermoelastic modules. Each of the modules includes one or more structures formed of shape memory alloy, which converts from austenite to martensite upon application of a first stress and release latent heat from the conversion. During a first part of a heating/cooling cycle, a first module is stressed to cause conversion. The latent heat released from the first module is rejected to a heat sink while a second unstressed module absorbs heat from a heat source. During a second part of the heating/cooling cycle, the first and second modules are connected together to transfer heat therebetween for heat recovery. The cycle can be repeated indefinitely with the first and second modules alternating roles. Structures of the thermoelastic cooling material and specific applications thereof are also disclosed.
    Type: Grant
    Filed: September 21, 2015
    Date of Patent: July 10, 2018
    Assignee: University of Maryland, College Park
    Inventors: Reinhard K. Radermacher, Ichiro Takeuchi, Yunho Hwang, Yiming Wu, Suxin Qian, Jiazhen Ling
  • Publication number: 20160084544
    Abstract: A system for heating/cooling includes a plurality of thermoelastic modules. Each of the modules includes one or more structures formed of shape memory alloy, which converts from austenite to martensite upon application of a first stress and release latent heat from the conversion. During a first part of a heating/cooling cycle, a first module is stressed to cause conversion. The latent heat released from the first module is rejected to a heat sink while a second unstressed module absorbs heat from a heat source. During a second part of the heating/cooling cycle, the first and second modules are connected together to transfer heat therebetween for heat recovery. The cycle can be repeated indefinitely with the first and second modules alternating roles. Structures of the thermoelastic cooling material and specific applications thereof are also disclosed.
    Type: Application
    Filed: September 21, 2015
    Publication date: March 24, 2016
    Inventors: Reinhard K. RADERMACHER, Ichiro TAKEUCHI, Yunho HWANG, Yiming WU, Suxin QIAN, Jiazhen LING