Patents by Inventor Suzanne Combe

Suzanne Combe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Acoustic wave device
    Patent number: 9209380
    Abstract: Embodiments described herein may provide an acoustic wave device, a method of fabricating an acoustic wave device, and a system incorporating an acoustic wave device. The acoustic wave device may include a transducer disposed on a substrate, with a contact coupled with the transducer. The acoustic wave device may further include a wall layer and cap that define an enclosed opening around the transducer. A via may be disposed through the cap and wall layer over the contact, and a top metal may be disposed in the via. The top metal may form a pillar in the via and a pad on the cap above the via. The pillar may provide an electrical connection between the pad and the contact. In some embodiments, the acoustic wave device may be formed as a wafer-level package on a substrate wafer.
    Type: Grant
    Filed: March 8, 2013
    Date of Patent: December 8, 2015
    Assignee: TriQuint Semiconductor, Inc.
    Inventors: Suzanne Combe, Kurt Steiner, Alan S. Chen, Charles E. Carpenter, Ian Yee, Jean Briot, George Grama
  • Acoustic wave filter manufacturing method using photo-definable epoxy for suppression of unwanted acoustic energy
    Patent number: 9166548
    Abstract: A SAW filter is fabricated with input and output transducers on a piezoelectric substrate and an epoxy based photo-definable acoustic absorber on the substrate for suppressing unwanted acoustic waves. The photo-definable acoustic absorber has a viscosity in a range from about 50 centistokes to 12000 centistokes and a thickness from about 10 microns to 120 microns. One acoustic absorber includes an SU-8 family member epoxy.
    Type: Grant
    Filed: July 28, 2010
    Date of Patent: October 20, 2015
    Assignee: TriQuint Semiconductor, Inc.
    Inventors: George Grama, Suzanne Combe, Rodolfo Chang
  • High coupling, low loss saw filter and associated method
    Patent number: 8552819
    Abstract: Disclosed embodiments include a surface acoustic wave device having electrode period, electrode width, and/or ratio of electrode width to electrode period varied in a prescribed manner.
    Type: Grant
    Filed: October 26, 2011
    Date of Patent: October 8, 2013
    Assignee: TriQuint Semiconductor, Inc.
    Inventors: Benjamin P. Abbott, Alan Chen, Taeho Kook, Kurt Steiner, Robert Aigner, Suzanne Combe, Timothy Daniel, Natalya F. Naumenko, Julien Gratier
  • HIGH COUPLING, LOW LOSS SAW FILTER AND ASSOCIATED METHOD
    Publication number: 20130106535
    Abstract: Disclosed embodiments include a surface acoustic wave device having electrode period, electrode width, and/or ratio of electrode width to electrode period varied in a prescribed manner.
    Type: Application
    Filed: October 26, 2011
    Publication date: May 2, 2013
    Applicant: TRIQUINT SEMICONDUCTOR, INC.
    Inventors: Benjamin P. Abbott, Alan Chen, Taeho Kook, Kurt Steiner, Robert Aigner, Suzanne Combe, Timothy Daniel, Natalya F. Naumenko, Julien Gratier
  • Acoustic wave filters using photo-definable epoxy for suppression of unwanted acoustic energy
    Patent number: 7800281
    Abstract: A SAW filter comprising an input transducer and an output transducer fabricated on a piezoelectric substrate and an epoxy based photo-definable acoustic absorber on the substrate for suppressing unwanted acoustic waves. The photo-definable acoustic absorber has a viscosity in a range from about 50 centistokes to 12000 centistokes and a thickness from about 10 microns to 120 microns. One acoustic absorber includes an SU-8 family member epoxy.
    Type: Grant
    Filed: November 25, 2008
    Date of Patent: September 21, 2010
    Assignee: Triquint Semiconductor, Inc.
    Inventors: George Grama, Suzanne Combe, Rodolfo Chang
  • Method of bonding a semiconductor wafer to a support substrate
    Publication number: 20070184630
    Abstract: A method of bonding a semiconductor wafer to a support substrate comprising the steps of: providing a semiconductor wafer; coating at least part of one face of the wafer with a water soluble coating layer; providing a double sided adhesive tape, at least one side of the adhesive tape comprising a thermal release adhesive; adhering the double sided adhesive tape to coating layer by means of said thermal release adhesive; adhering the reverse side of the adhesive tape to the support substrate.
    Type: Application
    Filed: February 8, 2006
    Publication date: August 9, 2007
    Inventors: John Cullen, Suzanne Combe