Patents by Inventor SUZANNE DUNPHY

SUZANNE DUNPHY has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for making a redistributed wafer using transferrable redistribution layers
    Patent number: 8772058
    Abstract: A method of making redistributed electronic devices that includes providing a wafer having a plurality of electronic devices, each electronic device having a pattern of contact areas forming die pads. The method also includes forming redistribution layers on a temporary substrate having a pattern of contact areas forming wafer bonding pads matching the die pads and a pattern of contact areas forming redistributed pads different than the wafer bonding pads, the wafer bonding pads are coupled to the redistributed pads through a plurality of stacked conductive and insulating layers. The die pads are coupled to the wafer bonding pads, and the temporary substrate is removed. The wafer and redistribution layers are then divided into a plurality of redistributed electronic devices.
    Type: Grant
    Filed: February 2, 2012
    Date of Patent: July 8, 2014
    Assignee: Harris Corporation
    Inventors: Thomas Reed, David Herndon, Suzanne Dunphy
  • Method for making a redistributed electronic device using a transferrable redistribution layer
    Patent number: 8685761
    Abstract: A method of making an electronic device with a redistribution layer includes providing an electronic device having a first pattern of contact areas, and forming a redistribution layer on a temporary substrate. The temporary substrate has a second pattern of contact areas matching the first pattern of contact areas, and a third pattern of contact areas different than the second pattern of contact areas. The second pattern of contact areas is coupled to the third pattern of contact areas through a plurality of stacked conductive and insulating layers. The first pattern of contact areas is coupled to the second pattern of contact areas on the transferrable redistribution layer. The temporary substrate is then removed to thereby form a redistributed electronic device.
    Type: Grant
    Filed: February 2, 2012
    Date of Patent: April 1, 2014
    Assignee: Harris Corporation
    Inventors: Thomas Reed, David Herndon, Suzanne Dunphy
  • METHOD FOR MAKING A REDISTRIBUTED ELECTRONIC DEVICE USING A TRANSFERRABLE REDISTRIBUTION LAYER
    Publication number: 20130203240
    Abstract: A method of making an electronic device with a redistribution layer includes providing an electronic device having a first pattern of contact areas, and forming a redistribution layer on a temporary substrate. The temporary substrate has a second pattern of contact areas matching the first pattern of contact areas, and a third pattern of contact areas different than the second pattern of contact areas. The second pattern of contact areas is coupled to the third pattern of contact areas through a plurality of stacked conductive and insulating layers. The first pattern of contact areas is coupled to the second pattern of contact areas on the transferrable redistribution layer. The temporary substrate is then removed to thereby form a redistributed electronic device.
    Type: Application
    Filed: February 2, 2012
    Publication date: August 8, 2013
    Applicant: Harris Corporation
    Inventors: THOMAS REED, DAVID HERNDON, SUZANNE DUNPHY
  • METHOD FOR MAKING A REDISTRIBUTED WAFER USING TRANSFERRABLE REDISTRIBUTION LAYERS
    Publication number: 20130203190
    Abstract: A method of making redistributed electronic devices that includes providing a wafer having a plurality of electronic devices, each electronic device having a pattern of contact areas forming die pads. The method also includes forming redistribution layers on a temporary substrate having a pattern of contact areas forming wafer bonding pads matching the die pads and a pattern of contact areas forming redistributed pads different than the wafer bonding pads, the wafer bonding pads are coupled to the redistributed pads through a plurality of stacked conductive and insulating layers. The die pads are coupled to the wafer bonding pads, and the temporary substrate is removed. The wafer and redistribution layers are then divided into a plurality of redistributed electronic devices.
    Type: Application
    Filed: February 2, 2012
    Publication date: August 8, 2013
    Applicant: Harris Corporation, Corporation of the State of Delaware
    Inventors: THOMAS REED, DAVID HERNDON, SUZANNE DUNPHY