Abstract: Provided is photosensitive resin composition that has low dielectric characteristics, low water vapor permeability, and good chemical resistance and can form a cured relief pattern at high resolution. This photosensitive resin composition includes 100 parts by mass of a polyimide precursor resin, 0.5-10 parts by mass of a photopolymerization initiator, and 50-500 parts by mass of a solvent. The polyimide precursor resin includes at least one terminal structure selected from the group consisting of general formulas (1)-(3). The total value for the aliphatic hydrocarbon group concentration T of the polyimide precursor resin is 4-35 wt %.

Abstract: To provide a negative photosensitive resin composition which exhibits satisfactory resolution even when shifts occur in focus depth, and which has satisfactory adhesion to a mold resin and exhibits a low dielectric constant; a method for producing a polyimide using the photosensitive resin composition; a method for producing a cured relief pattern; and a semiconductor device including the cured relief pattern. Disclosed is a negative photosensitive resin composition including a polyimide precursor having a structure represented by general formula (A1), (B) a photopolymerization initiator, and (C) a solvent.