Patents by Inventor Suzuki Shigeru

Suzuki Shigeru has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5396102
    Abstract: In an SIP type module of the type wherein memory ICs are mounted to both surfaces of a substrate, the present invention provides a face package type memory module wherein packaging is made in an inclined direction in place of vertical packaging of the prior art technique and only the memory ICs mounted to the upper surface side of the substrate are deviated to the positions closer to the end portion of the substrate in order to drastically reduce the packaging height.
    Type: Grant
    Filed: March 2, 1993
    Date of Patent: March 7, 1995
    Assignees: Hitachi, Ltd., Hitachi Tobu Semiconductor, Ltd.
    Inventors: Sugano Toshio, Tsukui Seiichirou, Suzuki Shigeru
  • Patent number: 5227664
    Abstract: In an SIP type module of the type wherein memory ICs are mounted to both surfaces of a substrate, the present invention provides a face package type memory module wherein packaging is made in an inclined direction in place of vertical packaging of the prior art technique and only the memory ICs mounted to the upper surface side of the substrate are deviated to the positions closer to the end portion of the substrate in order to drastically reduce the packaging height.
    Type: Grant
    Filed: June 5, 1991
    Date of Patent: July 13, 1993
    Assignees: Hitachi, Ltd., Hitachi Tobu Semiconductor
    Inventors: Sugano Toshio, Tsukui Seiichirou, Suzuki Shigeru
  • Patent number: 4984064
    Abstract: In an SIP type module of the type wherein memory ICs are mounted to both surfaces of a substrate, the present invention provides a face package type memory module wherein packaging is made in an inclined direction in place of vertical packaging of the prior art technique and only the memory ICs mounted to the upper surface side of the substrate are deviated to the position closer to the end portion of the substrate in order to drastically reduce the packaging height.
    Type: Grant
    Filed: February 15, 1989
    Date of Patent: January 8, 1991
    Assignees: Hitachi, Ltd., Hitachi Tobu Semiconductor, Ltd.
    Inventors: Sugano Toshio, Tsukui Seiichirou, Suzuki Shigeru
  • Patent number: 4823164
    Abstract: An image forming apparatus is arranged to comprise a removable film pack holder at a predetermined position of a main body of the image forming apparatus, wherein a film of the film pack loaded in said holder is exposed to an image of an original in the state in which a light shield plate for preventing sensitization is withdrawn, characterized in that there are provided on the main body of the image forming apparatus lock means for preventing removal of said film pack holder, the lock means being locked in the state in which said light shield plate is withdrawn, and lock releasing means for releasing the lock means from the locked state in linkage with insertion of the light shield plate into the film pack holder, thereby preventing the film pack holder from being removed in the state where the light shield plate is withdrawn.
    Type: Grant
    Filed: November 9, 1987
    Date of Patent: April 18, 1989
    Inventors: Ishikawa Masahiro, Suzuki Shigeru