Patents by Inventor Suzuki Yasuhiro

Suzuki Yasuhiro has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20050107501
    Abstract: The object of the present invention is to provide a compound resin mold consisting of solvent soluble and insoluble thermoplastic resin elements and a method for the manufacturing thereof. For example, in a case where said compound resin mold is a printed circuit board, the base board consists of said soluble thermoplastic resin element, with said insoluble elements being the metal thin film circuit and thermosetting resin film formed on said base board.
    Type: Application
    Filed: December 13, 2002
    Publication date: May 19, 2005
    Inventor: Suzuki Yasuhiro