Patents by Inventor Suzushi Kimura
Suzushi Kimura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7443655Abstract: A capacitor includes a first capacitor element and a second capacitor element laminated on this first capacitor element. The first capacitor element is a solid electrolytic capacitor including a through-hole electrode penetrating a valve metal sheet and having one surface on which cathode and anode terminal portions are taken out. The second capacitor element has first and second electrodes which are provided via a dielectric layer, and second through-hole electrodes penetrating the dielectric layer. The second through-hole electrodes are coupled to the first electrode and insulated from the second electrode. Lead-out portions of the second electrodes are exposed from the dielectric layer. The second through-hole electrodes and the lead-out portions are disposed alternately. The first electrode is electrically coupled to the first through-hole electrode and the second electrode is electrically coupled to the valve metal sheet.Type: GrantFiled: July 7, 2005Date of Patent: October 28, 2008Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Katsumasa Miki, Tatsuo Fujii, Yuji Midou, Suzushi Kimura
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Patent number: 7421781Abstract: According to the invention, the method of manufacturing a module component comprises an inserting step of inserting a chip component in a first molding die; a primary molding step of filling the first molding die with resin with a first end electrode of the chip component exposed; a peeling step of peeling the first molding die at a side of inserting the chip component; a secondary molding step of filling a second molding die with resin with a second end electrode of the chip component; and a forming step of forming a circuit wiring on one side or both sides of a molded element molded with resin, wherein the chip component is disposed according to a specified rule, and the chip component is molded with the resin.Type: GrantFiled: March 1, 2004Date of Patent: September 9, 2008Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Suzushi Kimura, Tsuyoshi Himori, Koji Hashimoto
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Publication number: 20080024955Abstract: A capacitor includes a first capacitor element and a second capacitor element laminated on this first capacitor element. The first capacitor element is a solid electrolytic capacitor including a through-hole electrode penetrating a valve metal sheet and having one surface on which cathode and anode terminal portions are taken out. The second capacitor element has first and second electrodes which are provided via a dielectric layer, and second through-hole electrodes penetrating the dielectric layer. The second through-hole electrodes are coupled to the first electrode and insulated from the second electrode. Lead-out portions of the second electrodes are exposed from the dielectric layer. The second through-hole electrodes and the lead-out portions are disposed alternately. The first electrode is electrically coupled to the first through-hole electrode and the second electrode is electrically coupled to the valve metal sheet.Type: ApplicationFiled: July 7, 2005Publication date: January 31, 2008Inventors: Katsumasa Miki, Tatsuo Fujii, Yuji Midou, Suzushi Kimura
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Patent number: 6917514Abstract: A solid electrolytic capacitor includes a valve metal sheet having a porous portion on one side of the sheet, a dielectric layer formed on the porous portion, a solid electrolyte layer formed on the dielectric layer, a collector layer formed on the solid electrolyte layer, a through-hole electrode connected to the collector layer and penetrating the valve metal sheet to be exposed to the other side of the sheet, and an electrode terminal insulated from the through-hole electrode and connected to the valve metal sheet. The capacitor further includes an insulating portion penetrating the valve metal sheet and a penetration electrode penetrating the insulating portion. The solid electrolytic capacitor has a large capacitance and an excellent radio frequency response, and can be easily mounted on a semiconductor device.Type: GrantFiled: July 15, 2003Date of Patent: July 12, 2005Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Yuji Mido, Tatsuo Fujii, Katsumasa Miki, Suzushi Kimura
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Patent number: 6879493Abstract: The invention relates to a module component having chip components buried in a circuit board, and a method of manufacturing the same, and more specifically it relates to a module component capable of obtaining desired circuit characteristics and functions stably if the size of the component is reduced, being produced very efficiently, and suited to machine mounting, and a method of manufacturing the same.Type: GrantFiled: August 7, 2002Date of Patent: April 12, 2005Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Suzushi Kimura, Tsuyoshi Himori, Koji Hashimoto
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Publication number: 20050047062Abstract: A solid electrolytic capacitor includes a valve metal sheet having a porous portion on one side of the sheet, a dielectric layer formed on the porous portion, a solid electrolyte layer formed on the dielectric layer, a collector layer formed on the solid electrolyte layer, a through-hole electrode connected to the collector layer and penetrating the valve metal sheet to be exposed to the other side of the sheet, and an electrode terminal insulated from the through-hole electrode and connected to the valve metal sheet. The capacitor further includes an insulating portion penetrating the valve metal sheet and a penetration electrode penetrating the insulating portion. The solid electrolytic capacitor has a large capacitance and an excellent radio frequency response, and can be easily mounted on a semiconductor device.Type: ApplicationFiled: July 15, 2003Publication date: March 3, 2005Inventors: Yuji Mido, Tatsuo Fujii, Katsumasa Miki, Suzushi Kimura
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Patent number: 6855177Abstract: A method for manufacturing large capacitance solid electrolytic capacitors that can be connected direct with semiconductor component, and offer a superior high frequency characteristic. An aluminum foil 3 is made porous in one of the surfaces, a dielectric layer 2 is formed on the porous portion, a through hole 4 is provided in the aluminum foil 3 at a certain specific location. An insulation layer 5 is formed to cover the other surface, viz. non-porous surface, of the aluminum foil 3 and the inner wall surface of through hole 4, a solid electrolytic layer 6 is provided on the dielectric layer 2, and a through hole electrode 7 is formed in the through hole 4, and then a collector layer 8 is formed on the solid electrolytic layer 6. The insulation layer 5 disposed on aluminum foil 3 is provided with an opening 9 at a certain specific location, and a connection terminal 10 is provided at the opening 9 of insulation layer 5 and the exposed surface of the through hole electrode 7, respectively.Type: GrantFiled: June 24, 2002Date of Patent: February 15, 2005Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Tatsuo Fujii, Katsumasa Miki, Makoto Nakano, Suzushi Kimura, Yuji Mido
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Patent number: 6852137Abstract: A method for manufacturing solid electrolytic capacitor that can be mounted direct on a semiconductor component and offers a superior high frequency characteristic. An aluminum foil 20 is provided on one surface with a resist film 23 and then with a through hole 24. Next, an insulation film 25 is formed to cover the other surface of aluminum foil 20 and to fill the first through hole, and then the resist film 23 is removed; and then the surface of aluminum foil 20 is roughened to be provided with a dielectric layer 27 thereon. A second through hole 36 is formed in the insulation film 25, which is filling the first through hole 24. A through hole electrode 28 is formed in the second through hole; and then, on the surface of the dielectric layer 27, a solid electrolytic layer 29 and a collector layer 30 are formed. After an opening 37 is provided, a first connection terminal 31 is formed therein, and a second connection electrode 32 on the exposed surface of the through hole electrode 28.Type: GrantFiled: July 16, 2002Date of Patent: February 8, 2005Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Katsumasa Miki, Yuji Mido, Tatsuo Fujii, Makoto Nakano, Suzushi Kimura
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Patent number: 6822849Abstract: A solid electrolytic capacitor includes a bulb-metal sheet of which first face has a porous section. A dielectric film, a solid electrolyte layer, and a current-collecting layer are formed in this order on the porous section. On top of the current-collecting layer, a reinforcing plate is bonded. A second face opposite to the first face of the sheet has a connecting terminal conductive to the current-collecting layer. This connecting terminal is coupled to a through-hole electrode which extends through the bulb-metal sheet for appearing outside the second face. The second face has another connecting terminal conductive to the bulb-metal sheet. This structure makes the capacitor thin, and allows the capacitor to increase its stress-resistance and be excellent in responsiveness to a high frequency as well as in mounting convenience.Type: GrantFiled: November 10, 2003Date of Patent: November 23, 2004Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Katsumasa Miki, Tatsuo Fujii, Yuji Mido, Suzushi Kimura
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Patent number: 6806428Abstract: The invention relates to a module component having chip components buried in a circuit board, and a method of manufacturing the same, and more specifically it relates to a module component capable of obtaining desired circuit characteristics and functions stably if the size of the component is reduced, being produced very efficiently, and suited to machine mounting, and a method of manufacturing the same.Type: GrantFiled: February 12, 2001Date of Patent: October 19, 2004Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Suzushi Kimura, Tsuyoshi Himori, Koji Hashimoto
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Patent number: 6794260Abstract: A method of manufacturing solid electrolytic capacitors that can be directly connected to semiconductor components and have a faster response to a high frequency as well as a larger capacitance includes: a dielectric forming stage where a valve metal sheet (2) is made porous and a dielectric coating (7) is provided on the porous face (3); an element forming stage where a solid electrolytic layer (8) and a collector layer (10) are formed on the dielectric coating (7); and a terminal forming stage where a connecting terminal (16) for connecting to an external electrode is formed. The element forming stage includes the steps of forming the solid electrolytic layer (8); a forming through-hole electrode (9) in a through-hole (5) that is prepared on the valve metal sheet (2); and forming the collector (10) on the solid electrolytic layer (8).Type: GrantFiled: October 8, 2003Date of Patent: September 21, 2004Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Tatsuo Fujii, Makoto Nakano, Yuji Mido, Katsumasa Miki, Suzushi Kimura
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Patent number: 6785147Abstract: The present invention aims to provide a circuit module that includes a sheet-like solid electrolytic capacitor and reduces an area and volume required for mounting electronic components. In the sheet-like solid electrolytic capacitor, valve metal sheet 11 has dielectric layer 13 and current collector layer 12 formed on the surface thereof, and is packaged by insulators 14 and 15. The circuit module is structured to embed the sheet-like solid electrolytic capacitor in a circuit board.Type: GrantFiled: June 23, 2003Date of Patent: August 31, 2004Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Katsumasa Miki, Yuji Mido, Tetsuhiro Korechika, Suzushi Kimura
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Publication number: 20040165361Abstract: The invention relates to a module component having chip components buried in a circuit board, and a method of manufacturing the same, and more specifically it relates to a module component capable of obtaining desired circuit characteristics and functions stably if the size of the component is reduced, being produced very efficiently, and suited to machine mounting, and a method of manufacturing the same.Type: ApplicationFiled: March 1, 2004Publication date: August 26, 2004Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.Inventors: Suzushi Kimura, Tsuyoshi Himori, Koji Hashimoto
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Patent number: 6775126Abstract: A dielectric layer is formed on a surface of a porous portion formed at least on a surface of a valve metal sheet. A solid electrolyte layer is formed on the dielectric layer, and a collector layer is formed on the solid electrolyte layer. A first insulating portion is formed on an outer periphery of the dielectric layer, and a solid electrolyte layer is formed on a portion of the dielectric layer corresponding to an opening of the first insulating portion. A portion of the solid electrolyte layer is formed on the first insulating portion. A second insulating portion is formed on the first insulating portion and on the outer periphery of the solid electrolyte layer. A collector layer is formed on a surface of the solid electrolyte layer exposed through an opening of the second insulating portion, thus providing a solid electrolytic capacitor. The solid electrolytic capacitor has less current leakage and a high withstand voltage.Type: GrantFiled: October 22, 2003Date of Patent: August 10, 2004Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Tatsuo Fujii, Katsumasa Miki, Yuji Mido, Suzushi Kimura
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Patent number: 6775125Abstract: A solid electrolytic capacitor having a high capacitance and excellent high frequency response including a valve metal sheet which is made porous, a dielectric layer formed on the porous portion, a solid electrolyte layer formed on the dielectric layer, a collector layer and an electrode exposure area formed on the solid electrolyte layer, and an insulating section electrically insulating the electrode exposure area from the collector layer, in which the electrode exposure area and the collector layer are formed on the same surface of the valve metal sheet.Type: GrantFiled: January 13, 2003Date of Patent: August 10, 2004Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Suzushi Kimura, Katsumasa Miki, Yuji Mido, Tatsuo Fujii, Hideki Masumi
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Publication number: 20040130857Abstract: A solid electrolytic capacitor includes a bulb-metal sheet of which first face has a porous section. A dielectric film, a solid electrolyte layer, and a current-collecting layer are formed in this order on the porous section. On top of the current-collecting layer, a reinforcing plate is bonded. A second face opposite to the first face of the sheet has a connecting terminal conductive to the current-collecting layer. This connecting terminal is coupled to a through-hole electrode which extends through the bulb-metal sheet for appearing outside the second face. The second face has another connecting terminal conductive to the bulb-metal sheet. This structure makes the capacitor thin, and allows the capacitor to increase its stress-resistance and be excellent in responsiveness to a high frequency as well as in mounting convenience.Type: ApplicationFiled: November 10, 2003Publication date: July 8, 2004Inventors: Katsumasa Miki, Tatsuo Fujii, Yuji Mido, Suzushi Kimura
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Publication number: 20040130856Abstract: A dielectric layer is formed on a surface of a porous portion formed at least on a surface of a valve metal sheet. A solid electrolyte layer is formed on the dielectric layer, and a collector layer is formed on the solid electrolyte layer. A first insulating portion is formed on an outer periphery of the dielectric layer, and a solid electrolyte layer is formed on a portion of the dielectric layer corresponding to an opening of the first insulating portion. A portion of the solid electrolyte layer is formed on the first insulating portion. A second insulating portion is formed on the first insulating portion and on the outer periphery of the solid electrolyte layer. A collector layer is formed on a surface of the solid electrolyte layer exposed through an opening of the second insulating portion, thus providing a solid electrolytic capacitor. The solid electrolytic capacitor has less current leakage and a high withstand voltage.Type: ApplicationFiled: October 22, 2003Publication date: July 8, 2004Inventors: Tatsuo Fujii, Katsumasa Miki, Yuji Mido, Suzushi Kimura
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Publication number: 20040095710Abstract: The present invention aims to provide a circuit module that includes a sheet-like solid electrolytic capacitor and reduces an area and volume required for mounting electronic components. In the sheet-like solid electrolytic capacitor, valve metal sheet 11 has dielectric layer 13 and current collector layer 12 formed on the surface thereof, and is packaged by insulators 14 and 15. The circuit module is structured to embed the sheet-like solid electrolytic capacitor in a circuit board.Type: ApplicationFiled: June 23, 2003Publication date: May 20, 2004Inventors: Katsumasa Miki, Yuji Mido, Tetsuhiro Korechika, Suzushi Kimura
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Publication number: 20040090735Abstract: A solid electrolytic capacitor of the present invention comprises; a valve metal sheet which is made porous, a dielectric layer formed on the porous portion, a solid electrolyte layer formed on the dielectric layer, a collector layer and an electrode exposure area formed on the solid electrolyte layer, and an insulating section electrically insulating the electrode exposure area from the collector layer, in which the electrode exposure area and the collector layer are formed on the same surface of the valve metal sheet. It is also possible to laminate a plurality of the capacitor elements. According to the present invention, a solid electrolytic capacitor realizing a reduction in size while achieving a high capacitance and excellent high frequency response is provided.Type: ApplicationFiled: January 13, 2003Publication date: May 13, 2004Inventors: Suzushi Kimura, Katsumasa Miki, Yuji Mido, Tatsuo Fujii, Hideki Masumi
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Publication number: 20040049899Abstract: A method of manufacturing the solid electrolytic capacitors that can be directly connected to semiconductor components and have a faster response to a high frequency as well as a larger capacitance includes: a dielectric forming stage where a valve metal sheet (2) is made porous and dielectric coating (7) is provided on the porous face (3); an element forming stage where solid electrolytic layer (8) and collector layer (10) are formed on the dielectric coating (7); and a terminal forming stage where connecting terminal (16) to an external electrode is formed. The element forming stage includes the steps of: forming solid electrolytic layer (8); forming through-hole electrode (9) in through-hole (5) that is prepared on valve metal sheet (2); and forming collector (10) on solid electrolytic layer (8).Type: ApplicationFiled: October 8, 2003Publication date: March 18, 2004Inventors: Tatsuo Fujii, Makoto Nakano, Yuji Mido, Katsumasa Miki, Suzushi Kimura