Abstract: The present invention relates to peripheral perfusion measurement. In order to provide more detailed peripheral perfusion characteristics for better knowledge about a current situation, a device (10) for peripheral perfusion measurement is provided that comprises an image data input (12), a data processor (14) and an output interface (16). The image data input receives at least one perfusion angiographic 2D X-ray image of a region of interest of a subject's foot and a 3D foot-model comprising spatial perfusion-related parameters. The data processor registers the 3D foot-model with the foot in the at least one perfusion angiographic X-ray image. The registering comprises a pose-estimation of the foot in the 2D X-ray image. The information is mapped between the 2D image and the 3D foot-model based on the pose-estimation. Image processing modification instructions are identified based on the mapped information.

Abstract: Power module has press-fit pins for the electrical and mechanical connection for the terminals, insertable into sleeves on the substrate. The substrate rests on a baseplate. Potential alignment frame ensures the accuracy of all elements. The mechanical and electrical connection of the power and signal terminals is realized by multiple (high-current) or single press-fit connections. When inserting the pins, they are fitting tightly in these sleeves by overcoming a frictional force and after fitting is established, for each single pin-fit, an electrical contact over a surface is established.

Abstract: An assembly with a secondary coil arranged on a coil carrier for a field device is described, wherein the field device comprises an electronics and an inductive interface connected to the electronics, and wherein the assembly can be used in the field device such that the field device can be connected via its interface to an inductive interface of a superordinate unit such that the secondary coil of the assembly, with a primary coil of the inductive interface of the superordinate unit, form a transformer for transmitting data and/or energy, which makes it possible to reduce the dimensions of field devices equipped with it and also contributes to increased operational safety, in that an assembly circuit formed by the secondary coil and at least one electronic component connected to the secondary coil via lines connected to it and arranged on the coil carrier is arranged on the coil carrier.

Abstract: Disclosed is a sensor comprising a sensor element that detects a measurand, the sensor element being in electrical contact with a sensor circuit that processes values derived from data from a secondary coil and/or from the measurand. The sensor circuit is in electrical contact with an ex-circuit. The sensor circuit is supplied a maximum input voltage and a maximum input current. The ex-circuit includes the secondary coil that receives an electrical signal from a primary coil. The electrical signal includes the data that are modulated onto the electrical signal. The sensor also includes a voltage limit that limits the voltage of the electrical signal to the maximum input voltage of the sensor circuit and a current limit that limits the current of the electrical signal to the maximum input current of the sensor circuit. Also disclosed are a sensor arrangement and a use of a sensor.

Abstract: The disclosure relates to a method for communication in process automation between a sensor and a connecting element connectable to the sensor, wherein the sensor is configured for acquisition of a measured variable of the process automation and for transmission of a value that is dependent upon the measured variable value to the connecting element, wherein the connecting element for transmission of the value dependent upon the measured variable to a parent unit is configured via a first protocol. The method is characterized in that communication between the sensor and the connecting element takes place without the knowledge of the parent unit using a second protocol, the second protocol being independent of the first protocol.

Abstract: The present disclosure discloses a connection element comprising an essentially cylindrical core, a primary coil for transmission and reception of data and/or for transmission of energy from or to a secondary coil, wherein the primary coil surrounds the core, and a first coupling body with a first segment and a second segment, wherein the second segment comprises the primary coil. In the connection element, the core at one end comprises a first magnetic body that is greater in diameter than the core and extends into the first segment. The present disclosure likewise discloses a sensor, as well as a sensor connection element including such a sensor and such a connection element.

Abstract: The present invention relates to a method for producing coated substrate bodies, wherein a plurality of substrate bodies comprising surfaces to be coated are provided with a colored coating surface, the method comprising following steps: providing the substrate bodies to be coated in the interior of a vacuum coating chamber, depositing a coating on a surface of the substrate bodies to be coated, the deposition of the coating involving the deposition of a metallic layer comprising at least two different metals, forming a colored oxide layer exhibiting a colored surface by anodic oxidation of the metallic layer, wherein: the anodic oxidation takes place in an alkaline electrolyte bath with the coated substrate bodies connected as anodes.

Abstract: An assembly with a secondary coil arranged on a coil carrier for a field device is described, wherein the field device comprises an electronics and an inductive interface connected to the electronics, and wherein the assembly can be used in the field device such that the field device can be connected via its interface to an inductive interface of a superordinate unit such that the secondary coil of the assembly, with a primary coil of the inductive interface of the superordinate unit, form a transformer for transmitting data and/or energy, which makes it possible to reduce the dimensions of field devices equipped with it and also contributes to increased operational safety, in that an assembly circuit formed by the secondary coil and at least one electronic component connected to the secondary coil via lines connected to it and arranged on the coil carrier is arranged on the coil carrier.

Abstract: The distributor module serves for distributing electrical power to at least two connected measuring devices (S1, S2) and for forwarding to at least one superordinated electronic data processing unit (NLU) information concerning at least one physical, measured variable transmitted from the connected at least two measuring devices. For this, the distributor module comprises a module housing (100) as well as an electronics module placed within the module housing (100).

Abstract: A method for manufacturing a vertical power semiconductor device is provided, wherein a first impurity is provided at the first main side of a semiconductor wafer. A first oxide layer is formed on the first main side of the wafer, wherein the first oxide layer is partially doped with a second impurity in such way that any first portion of the first oxide layer which is doped with the second impurity is spaced away from the semiconductor wafer by a second portion of the first oxide layer which is not doped with the second impurity and which is disposed between the first portion of the first oxide layer and the first main side of the semiconductor wafer. Thereafter a carrier wafer is bonded to the first oxide layer. During front-end-of-line processing on the second main side of the semiconductor wafer, the second impurity is diffused from the first oxide layer into the semiconductor wafer from its first main side by heat generated during the front-end-of-line processing.

Abstract: The present disclosure discloses a connection element comprising an essentially cylindrical core, a primary coil for transmission and reception of data and/or for transmission of energy from or to a secondary coil, wherein the primary coil surrounds the core, and a first coupling body with a first segment and a second segment, wherein the second segment comprises the primary coil. In the connection element, the core at one end comprises a first magnetic body that is greater in diameter than the core and extends into the first segment. The present disclosure likewise discloses a sensor, as well as a sensor connection element including such a sensor and such a connection element.

Abstract: A sensor arrangement for use in process automation, including a sensor with at least one sensor element for detecting a measurand of process automation, a first interface for transmitting a value that is a function of the measurand to a second interface, and a first coupling body having the first interface, the sensor further including a connection element for transmitting the value to a higher-level unit, the connection element including a first housing section with a second interface complementary to the first interface, wherein the first and second interfaces are designed for bi-directional communication between the sensor and the higher-level unit and to ensure the power supply to the sensor, a second housing section with a second coupling body complementary to the first coupling body and having an open and a locked condition, wherein the first housing section can be rotated in relation to the second housing section.

Abstract: The present application contemplates a method for manufacturing a power semiconductor device.

Abstract: The present disclosure includes an electronic circuit for use in process automation for transferring electrical energy from a terminal element to a sensor over an inductively coupled interface. The sensor measures the power it receives over the inductive interface and compares this value to a target power value. The difference between the actual and target values is communicated back to the terminal element. The terminal element adjusts its power output to the sensor to minimize this difference. The disclosure includes the use of the electronic circuit and a sensor arrangement comprising the electronic circuit, as well as a method for transmitting power.

Abstract: A sensor arrangement for use in process automation, including a sensor with at least one sensor element for detecting a measurand of process automation, a first interface for transmitting a value that is a function of the measurand to a second interface, and a first coupling body having the first interface, the sensor further including a connection element for transmitting the value to a higher-level unit, the connection element including a first housing section with a second interface complementary to the first interface, wherein the first and second interfaces are designed for bi-directional communication between the sensor and the higher-level unit and to ensure the power supply to the sensor, a second housing section with a second coupling body complementary to the first coupling body and having an open and a locked condition, wherein the first housing section can be rotated in relation to the second housing section.

Abstract: A method for manufacturing a vertical power semiconductor device is provided, wherein a first impurity is provided at the first main side of a semiconductor wafer. A first oxide layer is formed on the first main side of the wafer, wherein the first oxide layer is partially doped with a second impurity in such way that any first portion of the first oxide layer which is doped with the second impurity is spaced away from the semiconductor wafer by a second portion of the first oxide layer which is not doped with the second impurity and which is disposed between the first portion of the first oxide layer and the first main side of the semiconductor wafer. Thereafter a carrier wafer is bonded to the first oxide layer. During front-end-of-line processing on the second main side of the semiconductor wafer, the second impurity is diffused from the first oxide layer into the semiconductor wafer from its first main side by heat generated during the front-end-of-line processing.

Abstract: The present application contemplates a method for manufacturing a power semiconductor device.

Abstract: A sensor arrangement and cable for use in process automation, including a sensor having at least one sensor element for recording a value in process automation, a first interface for transmitting a measured value depending on the measured value to a second interface, the first interface including a first mechanical, and a cable for transmitting the value to a superordinate unit, the cable including said second interface, which is complementary to the first interface, and a second mechanical coupling complementary to the first mechanical coupling, wherein the second interface and mechanical coupling are arranged in a cable housing, wherein the sensor is detachably connectible to the cable by the first mechanical coupling and the second mechanical coupling, characterized in that the second mechanical coupling is arranged at an angle less than 180° to the longitudinal axis of the cable housing.

Abstract: A sensor module includes a sensor element with a transducer for emitting an electric analog primary signal, which depends on a measured value; and a circuit assembly for conditioning the primary signal and for unidirectional data communication of a digital signal, which depends on the primary signal, to a superordinated unit.

Abstract: The present disclosure includes an electronic circuit for use in process automation for transferring electrical energy from a terminal element to a sensor over an inductively coupled interface. The sensor measures the power it receives over the inductive interface and compares this value to a target power value. The difference between the actual and target values is communicated back to the terminal element. The terminal element adjusts its power output to the sensor to minimize this difference. The disclosure includes the use of the electronic circuit and a sensor arrangement comprising the electronic circuit, as well as a method for transmitting power.