Patents by Inventor Sven Rückbrod

Sven Rückbrod has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electrolytic copper plating bath compositions and a method for their use
    Patent number: 10538850
    Abstract: The present invention relates to aqueous acidic plating baths for copper and copper alloy deposition in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention comprises at least one source of copper ions, at least one acid and at least one guanidine compound. The plating bath is particularly useful for plating recessed structures with copper and build-up of copper pillar bump structures.
    Type: Grant
    Filed: April 20, 2016
    Date of Patent: January 21, 2020
    Assignee: Atotech Deutschland GmbH
    Inventors: Heiko Brunner, Dirk Rohde, Manuel Pölleth, Sven Rückbrod, Desthree Darwin, Sandra Niemann, Gerhard Steinberger
  • PLATING BATH COMPOSITION AND METHOD FOR ELECTROLESS PLATING OF PALLADIUM
    Publication number: 20180340261
    Abstract: The invention relates to an aqueous plating bath composition and a method for depositing a palladium layer by electroless plating onto a substrate. The aqueous plating bath composition according to the invention comprises a source for palladium ions, a reducing agent for palladium ions and a cyanide group containing aromatic compound. The aqueous plating bath composition according to the invention has an improved stability against undesired decomposition due to the cyanide group containing aromatic compounds while keeping the deposition rate for palladium at the desired satisfying value. The aqueous plating bath composition has also a prolonged life time. The cyanide group containing aromatic compounds of the invention allow for adjusting the deposition rate to a satisfying range over the bath life time and for electrolessly depositing palladium layers at lower temperatures.
    Type: Application
    Filed: November 28, 2016
    Publication date: November 29, 2018
    Inventors: Andreas WALTER, Christof SUCHENTRUNK, Thomas BECK, Gerhard STEINBERGER, Holger BERA, Heiko BRUNNER, Sven RÜCKBROD
  • ELECTROLYTIC COPPER PLATING BATH COMPOSITIONS AND A METHOD FOR THEIR USE
    Publication number: 20180112320
    Abstract: The present invention relates to aqueous acidic plating baths for copper and copper alloy deposition in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention comprises at least one source of copper ions, at least one acid and at least one guanidine compound. The plating bath is particularly useful for plating recessed structures with copper and build-up of copper pillar bump structures.
    Type: Application
    Filed: April 20, 2016
    Publication date: April 26, 2018
    Applicant: Atotech Deutschland GmbH
    Inventors: Heiko BRUNNER, Dirk ROHDE, Manuel PÖLLETH, Sven RÜCKBROD, Desthree DARWIN, Sandra NIEMANN, Gerhard STEINBERGER
  • Plating bath for electroless deposition of nickel layers
    Patent number: 9175399
    Abstract: The present invention relates to aqueous plating bath compositions for deposition of nickel and nickel alloys utilizing novel stabilizing agents possessing a carbon-carbon triple bond and a functional group to enhance the bath performance.
    Type: Grant
    Filed: May 31, 2013
    Date of Patent: November 3, 2015
    Assignee: Atotech Deutschland GmbH
    Inventors: Heiko Brunner, Jan Picalek, Iulia Bejan, Carsten Krause, Holger Bera, Sven Rückbrod
  • PLATING BATH FOR ELECTROLESS DEPOSITION OF NICKEL LAYERS
    Publication number: 20150110965
    Abstract: The present invention relates to aqueous plating bath compositions for deposition of nickel and nickel alloys utilizing novel stabilising agents possessing a carbon-carbon triple bond and a functional group to enhance the bath performance.
    Type: Application
    Filed: May 31, 2013
    Publication date: April 23, 2015
    Applicant: Atotech Deutschland GmbH
    Inventors: Heiko Brunner, Jan Picalek, Iulia Bejan, Carsten Krause, Holger Bera, Sven Rückbrod