Patents by Inventor Sven Runte

Sven Runte has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10797221
    Abstract: Assemblies for an ultrasonic probe and manufacturing methods are presented. In one example, the method includes additively forming first portions of the assembly using a first material with first acoustic properties and second portions of the assembly using a second material with second acoustic properties, the first and second acoustic properties being configured to modify ultrasonic signals of the ultrasonic probe. In another aspect, a housing for an ultrasonic probe is presented. The housing includes additively-formed portions, a fluid channel, and at least one cavity. The first additively-formed portions include a first material with first acoustic properties. The second additively-formed portions include a second material with second acoustic properties. The first and second acoustic properties are configured to modify ultrasonic signals of the ultrasonic probe. The fluid channel is for receiving fluid within the housing of the ultrasonic probe.
    Type: Grant
    Filed: February 24, 2017
    Date of Patent: October 6, 2020
    Assignee: Baker Hughes, a GE Company, LLC
    Inventors: Matthew Harvey Krohn, Sven Runte, Vadim Bromberg, Kwok Pong Chan, Alexander Felix Fiseni, Mihirkumar Pravinbhai Patel
  • Publication number: 20190369058
    Abstract: Systems and methods for monitoring the condition of ultrasonic transducers and ultrasonic probes used in non-destructive testing are provided. In one aspect, a degree of deterioration and end of life of an ultrasonic transducer can be estimated based upon measured environmental and/or operating parameters of the ultrasonic transducer. In another aspect, testing parameters acquired by a single ultrasonic probe or different ultrasonic probes can be measured and analyzed to identify deterioration of an ultrasonic probe.
    Type: Application
    Filed: June 3, 2019
    Publication date: December 5, 2019
    Inventors: Alexander Fiseni, Stephan Schmitz, Christof Breidenbach, Stephan Falter, Daniel Koers, Marek Parusel, Lars Rohpeter, Sven Runte, Sebastian Standop
  • Publication number: 20180243793
    Abstract: Assemblies for an ultrasonic probe and manufacturing methods are presented. In one example, the method includes additively forming first portions of the assembly using a first material with first acoustic properties and second portions of the assembly using a second material with second acoustic properties, the first and second acoustic properties being configured to modify ultrasonic signals of the ultrasonic probe. In another aspect, a housing for an ultrasonic probe is presented. The housing includes additively-formed portions, a fluid channel, and at least one cavity. The first additively-formed portions include a first material with first acoustic properties. The second additively-formed portions include a second material with second acoustic properties. The first and second acoustic properties are configured to modify ultrasonic signals of the ultrasonic probe. The fluid channel is for receiving fluid within the housing of the ultrasonic probe.
    Type: Application
    Filed: February 24, 2017
    Publication date: August 30, 2018
    Inventors: Matthew Harvey Krohn, Sven Runte, Vadim Bromberg, Kwok Pong Chan, Alexander Felix Fiseni, Mihirkumar Pravinbhai Patel
  • Publication number: 20170326592
    Abstract: A phased array ultrasonic transducer includes a bonding wire structure, a damping material, a plurality of ultrasonic transducers, and a printed circuit board. The bonding wire structure includes a plurality of bonding wire elements. The damping material surrounds the bonding wire structure and is interposed with the plurality of bonding wire elements. The plurality of ultrasonic transducers is arranged in a matrix beneath a membrane, each of the plurality of ultrasonic transducers being coupled to a corresponding bonding wire element of the plurality of bonding wire elements. The printed circuit board includes a plurality of circuits. Each of the plurality of circuits is coupled to a corresponding bonding wire element of the plurality of bonding wire elements.
    Type: Application
    Filed: May 15, 2017
    Publication date: November 16, 2017
    Inventors: Alexander Felix Fiseni, Matthew Harvey Krohn, Stephan Falter, Sven Runte