Abstract: For providing a particularly efficient micro-structured cooler intended more specifically for cooling electronic components, it is proposed to proceed in the following manner to build this cooler: providing a stack of at least two metal foils (1) comprising channels (2) for coolant and one base plate (5) adapted to be brought into thermal contact with the electronic component (4) through a thermal contact surface (6), said metal foils (1) and said base plate (5) being joined together so as to form a single piece of material, said channels (2) having a width b ranging from 100 to 350 ?m, a depth t ranging from 30 to 150 ?m, a mean spacing s ranging from 30 to 300 ?m, residual foil thickness r remaining after formation of the channels (2) in the metal foils (1) ranging from 30 to 300 ?m and said base plate (5) having a thickness g ranging from 100 to 1,000 ?m.

Abstract: For providing a particularly efficient micro-structured cooler intended more specifically for cooling electronic components, it is proposed to proceed in the following manner to build this cooler: providing a stack of at least two metal foils (1) comprising channels (2) for coolant and one base plate (5) adapted to be brought into thermal contact with the electronic component (4) through a thermal contact surface (6), said metal foils (1) and said base plate (5) being joined together so as to form a single piece of material, said channels (2) having a width b ranging from 100 to 350 ?m, a depth t ranging from 30 to 150 ?m, a mean spacing s ranging from 30 to 300 ?m, residual foil thickness r remaining after formation of the channels (2) in the metal foils (1) ranging from 30 to 300 ?m and said base plate (5) having a thickness g ranging from 100 to 1,000 ?m, said cooler further having at least one splitting chamber (10) traversing the metal foils (1) approximately in the region of the thermal contact surface

Abstract: The invention relates to a microstructure cooler 3 for an article 4 to be cooled, whereby the cooler 3 includes a stack of at least two metal films 1 and one base plate 5 that can be brought via a thermal contact surface 6 into thermal contact with the article 4, the metal films 1 and the base plate 5 are joined to one another in a material fit, present in the metal films 1 are channels 2 for cooling medium, and the channels 2 have a width in the range of 100 to 2,000 ?m, a depth in the range of 25 to 1,000 ?m, and a mean interval in the range of 50 to 1,000, residual film thicknesses resulting from the channels 2 in the metal films 1 are in the range of 50 to 300 ?m, and the base plate 5 has a thickness in the range of 200 to 2,000 ?m.

Abstract: The invention relates to a microstructure cooler 3 for an article 4 to be cooled, whereby the cooler 3 includes a stack of at least two metal films 1 and one base plate 5 that can be brought via a thermal contact surface 6 into thermal contact with the article 4, the metal films 1 and the base plate 5 are joined to one another in a material fit, present in the metal films 1 are channels 2 for cooling medium, and the channels 2 have a width in the range of 100 to 2,000 &mgr;m, a depth in the range of 25 to 1,000 &mgr;m, and a mean interval in the range of 50 to 1,000, residual film thicknesses resulting from the channels 2 in the metal films 1 are in the range of 50 to 300 &mgr;m, and the base plate 5 has a thickness in the range of 200 to 2,000 &mgr;m.