Patents by Inventor Sven-Tuve Persson

Sven-Tuve Persson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Module including one or more chips
    Publication number: 20030090876
    Abstract: A module comprising one or more chips and a carrier. The invention is characterised in that the carrier (6) supports a conductive layer (7) that includes a number of conductors; in that chips (2-5; 10; 27-30) are mounted directly on conductive layer (7) of the carrier (6); in that said chips (2-5; 10, 27-30) are connected electrically directly to the conductor system (7); and in that the carrier-supported conductive layer includes terminals (8,9) in the form of solder balls or corresponding devices disposed on the same side of the carrier (6) as said chips.
    Type: Application
    Filed: October 10, 2002
    Publication date: May 15, 2003
    Inventors: Rune Groppfeldt, Leif Ljunggvist, Ulf Wahlstrom, Mark Tober, Sven-Tuve Persson, Bjorn Ekstrom