Abstract: A method for operating a visual display apparatus is specified. The apparatus comprises a first optoelectronic semiconductor component configured to emit electromagnetic radiation of a first wavelength and comprising a first intrinsic switch-on delay. The apparatus comprises a second optoelectronic semiconductor component configured to emit electromagnetic radiation of a second wavelength and comprising a second intrinsic switch-on delay. The second wavelength is different from the first wavelength. The first semiconductor component is operated with a first operating current according to a first actuation signal. The second semiconductor component is operated with a second operating current according to a second actuation signal.

Abstract: An optoelectronic semiconductor component may include a housing having a recess, and a chip carrier which is a part of the housing. The chip carrier may have a first fastening side and an upper side. The optoelectronic semiconductor chip may be mounted on the upper side in the recess. First electrical contact pads for external electrical contacting may be located on the first fastening side. Furthermore, second electrical contact pads for external electrical contacting may be located on a second fastening side, opposite to the first fastening side, of the housing. First and second electrical contact pads electrically assigned to one another may be electrically short-circuited so that the semiconductor component can be electrically contacted by the first or by the second fastening side.

Abstract: A method for operating a visual display apparatus is specified. The apparatus comprises a first optoelectronic semiconductor component configured to emit electromagnetic radiation of a first wavelength and comprising a first intrinsic switch-on delay. The apparatus comprises a second optoelectronic semiconductor component configured to emit electromagnetic radiation of a second wavelength and comprising a second intrinsic switch-on delay. The second wavelength is different from the first wavelength. The first semiconductor component is operated with a first operating current according to a first actuation signal. The second semiconductor component is operated with a second operating current according to a second actuation signal.

Abstract: An optoelectronic semiconductor component may include a housing having a recess, and a chip carrier which is a part of the housing. The chip carrier may have a first fastening side and an upper side. The optoelectronic semiconductor chip may be mounted on the upper side in the recess. First electrical contact pads for external electrical contacting may be located on the first fastening side. Furthermore, second electrical contact pads for external electrical contacting may be located on a second fastening side, opposite to the first fastening side, of the housing. First and second electrical contact pads electrically assigned to one another may be electrically short-circuited so that the semiconductor component can be electrically contacted by the first or by the second fastening side.

Abstract: A light-emitting diode includes at least one light-emitting diode chip, a carrier for the at least one light-emitting diode chip, and at least one control device integrated into the carrier, wherein each of the light-emitting diode chips is electrically connected to one of the at least one control devices, each of the at least one control devices includes a data storage device in which brightness data for each light-emitting diode chip which is connected to the control device is stored, and the control device drives the connected light-emitting diode chip with a current which is selected according to stored brightness data for the light-emitting diode chip.

Abstract: A light-emitting diode includes at least one light-emitting diode chip, a carrier for the at least one light-emitting diode chip, and at least one control device integrated into the carrier, wherein each of the light-emitting diode chips is electrically connected to one of the at least one control devices, each of the at least one control devices includes a data storage device in which brightness data for each light-emitting diode chip which is connected to the control device is stored, and the control device drives the connected light-emitting diode chip with a current which is selected according to stored brightness data for the light-emitting diode chip.

Abstract: A light-emitting diode includes at least one light-emitting diode chip, at least one control device, wherein each of the light-emitting diode chips is electrically connected to one of the at least one control devices, each of the at least one control devices including a data storage device in which brightness data for each light-emitting diode chip which is connected to the control device is stored, and the control device drives the connected light-emitting diode chip with a current which is selected according to stored brightness data for the light emitting-diode chip.

Abstract: In at least one embodiment, an optoelectronic semiconductor component includes at least two optoelectronic semiconductor chips, which are designed to emit electromagnetic radiation in mutually different wavelength ranges when in operation. The semiconductor chips are mounted on a mounting surface of a common carrier. Furthermore, the optoelectronic semiconductor component contains at least two non-rotationally symmetrical lens bodies, which are designed to shape the radiation into mutually different emission angles in two mutually orthogonal directions parallel to the mounting surface. One of the lens bodies is here associated with or arranged downstream of each of the semiconductor chips in an emission direction.

Abstract: An optoelectronic device includes at least one luminescence diode chip which emits electromagnetic radiation during operation of the optoelectronic device, and at least one shield against stray radiation which laterally surrounds the luminescence diode chip only in places, wherein each shield is integral with a component of the optoelectronic device.

Abstract: A light-emitting diode includes at least one light-emitting diode chip, at least one control device, wherein each of the light-emitting diode chips is electrically connected to one of the at least one control devices, each of the at least one control devices including a data storage device in which brightness data for each light-emitting diode chip which is connected to the control device is stored, and the control device drives the connected light-emitting diode chip with a current which is selected according to stored brightness data for the light emitting-diode chip.

Abstract: In at least one embodiment, an optoelectronic semiconductor component includes at least two optoelectronic semiconductor chips, which are designed to emit electromagnetic radiation in mutually different wavelength ranges when in operation. The semiconductor chips are mounted on a mounting surface of a common carrier. Furthermore, the optoelectronic semiconductor component contains at least two non-rotationally symmetrical lens bodies, which are designed to shape the radiation into mutually different emission angles in two mutually orthogonal directions parallel to the mounting surface. One of the lens bodies is here associated with or arranged downstream of each of the semiconductor chips in an emission direction.

Abstract: An optoelectronic semiconductor component includes a basic body, at least one semiconductor chip arranged thereon, and an encapsulation embedding the at least one semiconductor chip and composed of a radiation-transmissive material with scattering particles. A radiation-transmissive covering layer with an absorber is applied to the encapsulation.

Abstract: An optoelectronic device includes at least one luminescence diode chip which emits electromagnetic radiation during operation of the optoelectronic device, and at least one shield against stray radiation which laterally surrounds the luminescence diode chip only in places, wherein each shield is integral with a component of the optoelectronic device.

Abstract: An optoelectronic semiconductor component includes a basic body, at least one semiconductor chip arranged thereon, and an encapsulation embedding the at least one semiconductor chip and composed of a radiation-transmissive material with scattering particles. A radiation-transmissive covering layer with an absorber is applied to the encapsulation.

Abstract: In a light-emitting diode carrier 1, a plurality of light-emitting diodes 9 are mounted on the rear side 3 of the light-emitting diode carrier and project into a plurality of openings 2. During operation, the light-emitting diodes 9 radiate through the openings 2 of the light-emitting diode carrier 1. A film 10 is applied on the front side 4 of the light-emitting diode carrier 1, said film being transmissive to the radiation emitted by the light-emitting diodes and protecting the light-emitting diode carrier from ambient influences.

Abstract: An optical element comprises a radiation exit face for a light-emitting diode, said optical element being suitable for producing a radiation characteristic that breaks rotational symmetry, and a light-emitting diode comprising such an optical element, and an LED arrangement comprising a plurality of light-emitting diodes arranged on a carrier, wherein each of the light-emitting diodes is associated with its own optical element, which is arranged and configured such that a radiation characteristic of the respective light-emitting diode is formed with broken rotational symmetry, and wherein the optical elements are similarly implemented.

Abstract: In a light-emitting diode carrier 1, a plurality of light-emitting diodes 9 are mounted on the rear side 3 of the light-emitting diode carrier and project into a plurality of openings 2. During operation, the light-emitting diodes 9 radiate through the openings 2 of the light-emitting diode carrier 1. A film 10 is applied on the front side 4 of the light-emitting diode carrier 1, said film being transmissive to the radiation emitted by the light-emitting diodes and protecting the light-emitting diode carrier from ambient influences.

Abstract: An optical device includes a surface-mountable optical component with a base member having a recess filled with a transparent filler and a VCSEL element arranged in the recess. A receptacle is attached to the surface-mountable optical component. The receptacle is for receiving an optical fiber to optically connect the VCSEL element to the optical fiber. Accordingly, an inexpensive way of coupling a VCSEL element with an optical fiber is provided. In particular, the surface-mountable component can be produced using a high volume production so that the overall costs of the optical device are reduced, even if the receptacle is produced in lower numbers due to varying requirements in the way that the VCSEL will be coupled to an optical fiber.

Abstract: An optical device comprises a surface-mountable optical component (1) comprising a base member (4) having a recess (5) filled with a transparent filler (9), and an VCSEL element (7) arranged in the recess (5); and a receptacle (2) attached to the surface-mountable optical component (1), for receiving an optical fiber (20), thereby to optically connect the VCSEL element (7) with the optical fiber (20). Accordingly, there is provided an inexpensive way of coupling a VCSEL element with an optical fiber. In particular, the surface-mountable component is suitable for a high volume production so that the overall costs of the optical device are reduced, even if the receptacle is produced in lower numbers due to varying requirements in the way the VCSEL is to be coupled to an optical fiber.