Patents by Inventor Sven Wucherpfennig
Sven Wucherpfennig has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230151252Abstract: The present invention relates to an electrically conductive, room temperature stable, one-component (1K) epoxy adhesive composition comprising: a) an epoxy resin; b) at least one ionic constituent as a catalyst for epoxy homo-polymerization; c) electrically conductive particles; and, d) inorganic particles selected from the group consisting of barium sulphate (BaSO4), magnesium hydroxide (Mg(OH)2), aluminium hydroxide (Al(OH)3), zinc oxide (ZnO), zinc hydroxide (Zn(OH)2), titanium dioxide (TiO2), iron oxide and mixtures thereof.Type: ApplicationFiled: January 23, 2023Publication date: May 18, 2023Inventors: Sascha Poeller, Sven Wucherpfennig, Marc Estruga Ortiga, Anja Henckens
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Patent number: 9790341Abstract: The subject matter of the present application is a thermally expandable preparation that can be pumped at application temperatures below 70° C., containing (a) at least one first epoxy resin E1 that has an epoxy equivalent weight of at most 280 g/eq and a viscosity of at most 1250 Pa*s at 25° C., (b) at least one second epoxy resin E2 that has an epoxy equivalent weight of at least 300 g/eq and a viscosity of at most 250 Pa*s at 25° C., (c) at least one hardener that can be thermally activated, (d) at least one propellant that can be thermally activated, and (e) at least 1 wt. % of organic fibres having a fibre length of 0.2 mm to 10 mm.Type: GrantFiled: September 19, 2014Date of Patent: October 17, 2017Assignee: Henkel AG & Co. KGaAInventors: Emilie Barriau, Martin Renkel, Rainer Schoenfeld, Sven Wucherpfennig, Tim Welters
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Publication number: 20150064380Abstract: The subject matter of the present application is a thermally expandable preparation that can be pumped at application temperatures below 70° C., containing (a) at least one first epoxy resin E1 that has an epoxy equivalent weight of at most 280 g/eq and a viscosity of at most 1250 Pa*s at 25° C., (b) at least one second epoxy resin E2 that has an epoxy equivalent weight of at least 300 g/eq and a viscosity of at most 250 Pa*s at 25° C., (c) at least one hardener that can be thermally activated, (d) at least one propellant that can be thermally activated, and (e) at least 1 wt. % of organic fibres having a fibre length of 0.2 mm to 10 mm.Type: ApplicationFiled: September 19, 2014Publication date: March 5, 2015Inventors: Emilie BARRIAU, Martin Renkel, Rainer Schoenfeld, Sven Wucherpfennig, Tim Welters
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Publication number: 20140311619Abstract: The invention relates to a retrofit kit for a filler gun or a filler gun of a fuel pump with an integrated generator for generating electric energy. The retrofit kit or the filler gun contains: a sensor device which is equipped to detect a fueling process of the filler gun; a reproduction device which is equipped to reproduce information; and an electric energy source which supplies the reproduction device with electric energy on the basis of the detection of the fueling process.Type: ApplicationFiled: December 7, 2012Publication date: October 23, 2014Applicant: Alvern Media GmbHInventors: Arnold Herp, Joerg Peter Strasburger, Sven Wucherpfennig
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Patent number: 8790779Abstract: A thermally curable adhesive in strip or film form, having a thickness in the range of 0.1 to 5 mm, containing: a) at least one reactive epoxy prepolymer, b) at least one latent hardener for epoxies, and c) one or more elastomers that are selected from: c1) thermoplastic polyurethanes, c2) thermoplastic isocyanates, and c3) block copolymers having thermoplastic polymer blocks. Further components can additionally be contained, for example a blowing agent for foaming. The adhesive in the uncured state at 22° C. is bendable or wrappable and can be extended at least 100% before tearing. It can be laid onto a foil. It can be used, for example, for adhesive bonding of planar, tubular, or cylindrical components, preferably components made of metal, wood, ceramic, or ferrites.Type: GrantFiled: November 16, 2011Date of Patent: July 29, 2014Assignee: Henkel AG & Co. KGaAInventors: Eugen Bilcai, Emilie Barriau, Martin Renkel, Sven Wucherpfennig
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Publication number: 20120156412Abstract: A method for reinforcing a substrate having a hollow structure or for fixing an insert in such a substrate comprises introducing a one- or two-component expandable and curable preparation based on epoxy resin into a selected part of the hollow structure to be reinforced. The preparation cures by being heated to a temperature in the range from 20 to 100° C. or above, while being expanded. An epoxy resin prepolymer and an organic ammonium carbamate, which at a temperature in the range from 20° to 100° C. or above releases at least 25% of the CO2 bound as carbamate.Type: ApplicationFiled: February 29, 2012Publication date: June 21, 2012Applicant: Henkel AG & Co. KGaAInventors: Dennis BANKMANN, Emilie Barriau, Martin Renkel, Sven Wucherpfennig, Olaf Lammerschop, Karl Braun
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Publication number: 20120121878Abstract: A thermally curable adhesive in strip or film form, having a thickness in the range of 0.1 to 5 mm, containing: a) at least one reactive epoxy prepolymer, b) at least one latent hardener for epoxies, and c) one or more elastomers that are selected from: c1) thermoplastic polyurethanes, c2) thermoplastic isocyanates, and c3) block copolymers having thermoplastic polymer blocks. Further components can additionally be contained, for example a blowing agent for foaming. The adhesive in the uncured state at 22° C. is bendable or wrappable and can be extended at least 100% before tearing. It can be laid onto a foil. It can be used, for example, for adhesive bonding of planar, tubular, or cylindrical components, preferably components made of metal, wood, ceramic, or ferrites.Type: ApplicationFiled: November 16, 2011Publication date: May 17, 2012Applicant: Henkel AG & Co. KGaAInventors: Eugen Bilcai, Emilie Barriau, Martin Renkel, Sven Wucherpfennig
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Publication number: 20110297318Abstract: A process of bonding a metal substrate to a non-halogenated polymer, especially of bonding a polyolefin overcoat to a metallic tube or pipe, using an epoxy-based adhesive which comprises at least one salt of a metal ion M in an oxidation state of n which has a standard reduction potential E0M more positive than the standard reduction potential of the surface of the metal substrate; an object comprising a metal substrate and a non-halogenated polymer bonded together by this process; a tube or pipe made of a metal substrate onto which a layer of a non-halogenated polymer is bonded by a cured epoxy-based adhesive.Type: ApplicationFiled: August 17, 2011Publication date: December 8, 2011Applicants: Loctite (R&D) Limited, Henkel AG & Co. KGaAInventors: Emilie Barriau, David Farrell, Dennis Bankmann, Michael Doherty, Ciaran B. McArdle, Martin Renkel, Sven Wucherpfennig, Siegfried Kopannia
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Publication number: 20110301255Abstract: Disclosed is a thermally expandable and curable material containing: a) at least one epoxide prepolymer; b) at least one heat-activated curing agent for the prepolymer; c) at least one foaming agent; and d) at least one thermoplastic, non-reactive polyurethane selected from among polyurethanes containing a polyester chain. Also disclosed are the use of such a material for stiffening or reinforcing components as well as an extruded or injection-molded article made of such a material.Type: ApplicationFiled: April 27, 2011Publication date: December 8, 2011Applicant: Henkel AG & Co. KGaAInventors: Emilie BARRIAU, Olaf LAMMERSCHOP, Thomas ENGELS, Sven WUCHERPFENNIG, Petra PADURSCHEL, Mario MARCOLINI, Martin RENKEL
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Publication number: 20100151253Abstract: The present invention relates to primer compositions for adhesive bonding systems. The primer compositions may be in the form of sprayable aqueous dispersions, which are shelf stable at ambient temperatures for up to three months under ambient temperature conditions, and demonstrate a cure profile of 45 to 120 minutes within the temperature range of 220° F. to 350° F. within 60 minutes of application. Significantly, the inventive primer compositions are substantially free of chromate.Type: ApplicationFiled: July 8, 2005Publication date: June 17, 2010Applicants: Henkel KGaA, Henkel CorporationInventors: Marcel Roth, Jurgen Foll, Sven Wucherpfennig, Thomas Huver, Ulrike Schmidt-Freytag, Angela Gand, Thomas W. Regulski