Abstract: Trilayered Beam MEMS Device and Related Methods. According to one embodiment, a method for fabricating a trilayered beam is provided. The method can include depositing a sacrificial layer on a substrate and depositing a first conductive layer on the sacrificial layer. The method can also include forming a first conductive microstructure by removing a portion of the first conductive layer. Furthermore, the method can include depositing a structural layer on the first conductive microstructure, the sacrificial layer, and the substrate and forming a via through the structural layer to the first conductive microstructure.

Abstract: MEMS Device Having A Trilayered Beam And Related Methods. According to one embodiment, a movable, trilayered microcomponent suspended over a substrate is provided and includes a first electrically conductive layer patterned to define a movable electrode. The first metal layer is separated from the substrate by a gap. The microcomponent further includes a dielectric layer formed on the first metal layer and having an end fixed with respect to the substrate. Furthermore, the microcomponent includes a second electrically conductive layer formed on the dielectric layer and patterned to define an electrode interconnect for electrically communicating with the movable electrode.

Abstract: The present invention relates to micro-electro-mechanical systems (MEMS). The present invention relates to a design feature that allows lower actuation voltage for electrostatically actuated structures (i.e., switches or mirrors). The present invention further relates to a method for fabricating such a design that allows lower actuation voltage.

Abstract: Trilayered Beam MEMS Device and Related Methods. According to one embodiment, a method for fabricating a trilayered beam is provided. The method can include depositing a sacrificial layer on a substrate and depositing a first conductive layer on the sacrificial layer. The method can also include forming a first conductive microstructure by removing a portion of the first conductive layer. Furthermore, the method can include depositing a structural layer on the first conductive microstructure, the sacrificial layer, and the substrate and forming a via through the structural layer to the first conductive microstructure.

Abstract: The present invention relates to micro-electro-mechanical systems (MEMS). The present invention relates to a design feature that allows lower actuation voltage for electrostatically actuated structures (i.e., switches or mirrors). The present invention further relates to a method for fabricating such a design that allows lower actuation voltage.

Abstract: Trilayered Beam MEMS Device and Related Methods. According to one embodiment, a method for fabricating a trilayered beam is provided. The method can include depositing a sacrificial layer on a substrate and depositing a first conductive layer on the sacrificial layer. The method can also include forming a first conductive microstructure by removing a portion of the first conductive layer. Furthermore, the method can include depositing a structural layer on the first conductive microstructure, the sacrificial layer, and the substrate and forming a via through the structural layer to the first conductive microstructure.

Abstract: Trilayered Beam MEMS Device and Related Methods. According to one embodiment, a method for fabricating a trilayered beam is provided. The method can include depositing a sacrificial layer on a substrate and depositing a first conductive layer on the sacrificial layer. The method can also include forming a first conductive microstructure by removing a portion of the first conductive layer. Furthermore, the method can include depositing a structural layer on the first conductive microstructure, the sacrificial layer, and the substrate and forming a via through the structural layer to the first conductive microstructure.

Abstract: MEMS Device Having A Trilayered Beam And Related Methods. According to one embodiment, a movable, trilayered microcomponent suspended over a substrate is provided and includes a first electrically conductive layer patterned to define a movable electrode. The first metal layer is separated from the substrate by a gap. The microcomponent further includes a dielectric layer formed on the first metal layer and having an end fixed with respect to the substrate. Furthermore, the microcomponent includes a second electrically conductive layer formed on the dielectric layer and patterned to define an electrode interconnect for electrically communicating with the movable electrode.

Abstract: An optical MEMS device is fabricated in either a surface or bulk micromachining process wherein an integral process step entails providing an antireflective coating on one or more surfaces of a substrate through which optical information is to be transmitted. In one method, a surface micromachining process is carried out in which a sacrificial layer is formed and patterned on an optically transmissive substrate. A structural layer is formed on the sacrificial layer and fills in regions of the sacrificial layer that have been removed. An amount of the sacrificial layer is removed sufficient to define and release a microstructure and thereby render the microstructure movable for interaction with an optical signal directed toward the optically transmissive substrate. In another method, a bulk micromachining process is carried out in which a first substrate is provided that is composed of an optically transmissive material.