Abstract: Processes for recycling printed wire boards using environmentally-friendly compositions, wherein electronic components, precious metals and base metals may be collected for reuse and recycling.

Abstract: Processes for recycling printed wire boards using environmentally-friendly compositions, wherein electronic components, precious metals and base metals may be collected for reuse and recycling.

Abstract: Processes for recycling printed wire boards using environmentally-friendly compositions, wherein electronic components, precious metals and base metals may be collected for reuse and recycling.

Abstract: Processes for recycling printed wire boards using environmentally-friendly compositions, wherein electronic components, precious metals and base metals may be collected for reuse and recycling.

Abstract: Systems and methods for processing lead-containing glass are generally described. In certain embodiments, at least a portion of the lead within the bulk of the lead-containing glass is removed from the lead-containing glass and transferred to a liquid leaching medium. Removal of lead from the bulk of the lead-containing glass, as opposed to the surface and areas closely adjacent to the surface of the lead-containing glass, can allow for the production of recycled glass that includes substantially no lead within its boundaries.

Abstract: Systems and methods for the removal of electronic chips and other components from PWBs using liquid heat media are generally described. The systems and methods described herein can be used to remove solder, electronic chips (including those in which an integrated circuit is positioned on a piece of semiconductor material, such as silicon), and/or other electronic components from PWBs. In some such embodiments, the liquid heat medium may be at least partially separated from the solder and, in some cases, recycled back to a vessel in which the liquid heat medium is stored. The PWBs may be pre-heated, in some embodiments, prior to being immersed in a liquid heat transfer medium in which the solder is removed. In certain embodiments, an additional liquid heat medium may be used to remove underfill from PWBs. In certain embodiments, the electronic components separated from the PWBs may be at least partially separated according to size, density, and/or optical characteristics.

Abstract: Systems and methods for processing lead-containing glass are generally described. In certain embodiments, at least a portion of the lead within the bulk of the lead-containing glass is removed from the lead-containing glass and transferred to a liquid leaching medium. Removal of lead from the bulk of the lead-containing glass, as opposed to the surface and areas closely adjacent to the surface of the lead-containing glass, can allow for the production of recycled glass that includes substantially no lead within its boundaries.

Abstract: Processes for recycling printed wire boards using environmentally-friendly compositions, wherein electronic components, precious metals and base metals may be collected for reuse and recycling.