Patents by Inventor Sw Wei WANG

Sw Wei WANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thin semiconductor package for notched semiconductor die
    Patent number: 11942369
    Abstract: Implementations of a method of forming a semiconductor package may include forming a plurality of notches into a first side of a wafer, the first side of the wafer including a plurality of electrical contacts. The method may also include coating the first side of the wafer and an interior of the plurality of notches with a molding compound, grinding a second side of the wafer to thin the wafer to a desired thickness, forming a back metal on a second side of the wafer, exposing the plurality of electrical contacts through grinding a first side of the molding compound, and singulating the wafer at the plurality of notches to form a plurality of semiconductor packages.
    Type: Grant
    Filed: July 30, 2020
    Date of Patent: March 26, 2024
    Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Shutesh Krishnan, Sw Wei Wang, Ch Chew, How Kiat Liew, Fui Fui Tan
  • THIN SEMICONDUCTOR PACKAGE AND RELATED METHODS
    Publication number: 20200357697
    Abstract: Implementations of a method of forming a semiconductor package may include forming a plurality of notches into a first side of a wafer, the first side of the wafer including a plurality of electrical contacts. The method may also include coating the first side of the wafer and an interior of the plurality of notches with a molding compound, grinding a second side of the wafer to thin the wafer to a desired thickness, forming a back metal on a second side of the wafer, exposing the plurality of electrical contacts through grinding a first side of the molding compound, and singulating the wafer at the plurality of notches to form a plurality of semiconductor packages.
    Type: Application
    Filed: July 30, 2020
    Publication date: November 12, 2020
    Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Shutesh KRISHNAN, Sw Wei WANG, CH CHEW, How Kiat LIEW, Fui Fui TAN
  • Thin semiconductor package and related methods
    Patent number: 10763173
    Abstract: Implementations of a method of forming a semiconductor package may include forming a plurality of notches into a first side of a wafer, the first side of the wafer including a plurality of electrical contacts. The method may also include coating the first side of the wafer and an interior of the plurality of notches with a molding compound, grinding a second side of the wafer to thin the wafer to a desired thickness, forming a back metal on a second side of the wafer, exposing the plurality of electrical contacts through grinding a first side of the molding compound, and singulating the wafer at the plurality of notches to form a plurality of semiconductor packages.
    Type: Grant
    Filed: April 26, 2019
    Date of Patent: September 1, 2020
    Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Shutesh Krishnan, Sw Wei Wang, Ch Chew, How Kiat Liew, Fui Fui Tan
  • THIN SEMICONDUCTOR PACKAGE AND RELATED METHODS
    Publication number: 20190252255
    Abstract: Implementations of a method of forming a semiconductor package may include forming a plurality of notches into a first side of a wafer, the first side of the wafer including a plurality of electrical contacts. The method may also include coating the first side of the wafer and an interior of the plurality of notches with a molding compound, grinding a second side of the wafer to thin the wafer to a desired thickness, forming a back metal on a second side of the wafer, exposing the plurality of electrical contacts through grinding a first side of the molding compound, and singulating the wafer at the plurality of notches to form a plurality of semiconductor packages.
    Type: Application
    Filed: April 26, 2019
    Publication date: August 15, 2019
    Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Shutesh KRISHNAN, Sw Wei WANG, CH CHEW, How Kiat LIEW, Fui Fui TAN