Patents by Inventor Swain Yeo

Swain Yeo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Attachment of flip chips to substrates
    Publication number: 20060115927
    Abstract: An anisotropic conductive layer is formed between a substrate and a flip chip having multiple contacts. Insulating layers are formed on the lateral surfaces of the electrical contacts. When the flip chip is attached to a substrate, the insulating layers reduce the chance of an electrical path being formed in the lateral direction between the contacts.
    Type: Application
    Filed: November 29, 2002
    Publication date: June 1, 2006
    Applicant: Infineon Technologies AG
    Inventors: Swain Yeo, Ai Tan