Patents by Inventor Swami Siddharth

Swami Siddharth has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230413449
    Abstract: Provided is a method of fabricating an electronic circuit including providing a copper ion solution. The copper ion solution includes a source of copper (II) ions, L-ascorbic acid, and water. The copper ion solution is applied on a substrate to form a coating layer. A heat source is provided to locally heat the coating layer to react copper ions in the coating layer to form copper conductive patterns.
    Type: Application
    Filed: November 2, 2022
    Publication date: December 21, 2023
    Applicant: National Tsing Hua University
    Inventors: Ming-Tsang Lee, Yu-Bin Chen, Swami Siddharth