Patents by Inventor Swapan K. Bhattacharya

Swapan K. Bhattacharya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for providing a low temperature curable gallium alloy for multichip module substrates
    Patent number: 6554923
    Abstract: A system and method for providing via-hole filling for microelectronic interconnections, is disclosed. Gallium metal is melted and mixed with a measured amount of copper and nickel, thereby creating a gallium alloy. Via holes are drilled within a substrate and filled with the gallium alloy. Excess gallium alloy is removed from the substrate. The substrate, having the filled via-holes therein, is then cured within the temperature range of room temperature to approximately 200 degrees Celsius. The gallium alloy may also be used for printing interconnect lines on a board surface.
    Type: Grant
    Filed: February 15, 2001
    Date of Patent: April 29, 2003
    Assignee: Georgia Tech Research Corp.
    Inventors: Swapan K. Bhattacharya, Daniel F. Baldwin
  • System and method for providing a low temperature curable gallium alloy for multichip module substrates
    Publication number: 20010044206
    Abstract: A system and method for providing via-hole filling for microelectronic interconnections, is disclosed. Gallium metal is melted and mixed with a measured amount of copper and nickel, thereby creating a gallium alloy. Via holes are drilled within a substrate and filled with the gallium alloy. Excess gallium alloy is removed from the substrate. The substrate, having the filled via-holes therein, is then cured within the temperature range of room temperature to approximately 200 degrees Celsius. The gallium alloy may also be used for printing interconnect lines on a board surface.
    Type: Application
    Filed: February 15, 2001
    Publication date: November 22, 2001
    Applicant: Georgia Tech Research Corporation
    Inventors: Swapan K. Bhattacharya, Daniel F. Baldwin