Patents by Inventor Swathi Vijayakumar

Swathi Vijayakumar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Radio frequency front-end structures
    Patent number: 11937367
    Abstract: Disclosed herein are radio frequency (RF) front-end structures, as well as related methods and devices. In some embodiments, an RF front-end package may include an RF package substrate including an embedded passive circuit element. At least a portion of the embedded passive circuit element may be included in a metal layer of the RF package substrate. The RF package substrate may also include a ground plane in the metal layer.
    Type: Grant
    Filed: July 3, 2023
    Date of Patent: March 19, 2024
    Assignee: Intel Corporation
    Inventors: Sidharth Dalmia, Zhenguo Jiang, William J. Lambert, Kirthika Nahalingam, Swathi Vijayakumar
  • RADIO FREQUENCY FRONT-END STRUCTURES
    Publication number: 20230354508
    Abstract: Disclosed herein are radio frequency (RF) front-end structures, as well as related methods and devices. In some embodiments, an RF front-end package may include an RF package substrate including an embedded passive circuit element. At least a portion of the embedded passive circuit element may be included in a metal layer of the RF package substrate. The RF package substrate may also include a ground plane in the metal layer.
    Type: Application
    Filed: July 3, 2023
    Publication date: November 2, 2023
    Applicant: Intel Corporation
    Inventors: Sidharth Dalmia, Zhenguo Jiang, William J. Lambert, Kirthika Nahalingam, Swathi Vijayakumar
  • Radio frequency front-end structures
    Patent number: 11729902
    Abstract: Disclosed herein are radio frequency (RF) front-end structures, as well as related methods and devices. In some embodiments, an RF front-end package may include an RF package substrate including an embedded passive circuit element. At least a portion of the embedded passive circuit element may be included in a metal layer of the RF package substrate. The RF package substrate may also include a ground plane in the metal layer.
    Type: Grant
    Filed: February 5, 2019
    Date of Patent: August 15, 2023
    Assignee: Intel Corporation
    Inventors: Sidharth Dalmia, Zhenguo Jiang, William James Lambert, Kirthika Nahalingam, Swathi Vijayakumar
  • RADIO FREQUENCY FRONT-END STRUCTURES
    Publication number: 20200253040
    Abstract: Disclosed herein are radio frequency (RF) front-end structures, as well as related methods and devices. In some embodiments, an RF front-end package may include an RF package substrate including an embedded passive circuit element. At least a portion of the embedded passive circuit element may be included in a metal layer of the RF package substrate. The RF package substrate may also include a ground plane in the metal layer.
    Type: Application
    Filed: February 5, 2019
    Publication date: August 6, 2020
    Applicant: Intel Corporation
    Inventors: Sidharth Dalmia, Zhenguo Jiang, William James Lambert, Kirthika Nahalingam, Swathi Vijayakumar