Patents by Inventor Swee Cheng

Swee Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Solder printing process to reduce void formation in a microvia
    Publication number: 20080099539
    Abstract: In one embodiment, a method is provided. The method comprises filling a microvia formed in a bond pad with solder paste comprising solder balls of the first size; and coating the bond pad with solder paste comprising solder balls of the second size, wherein the second size is greater than the first size.
    Type: Application
    Filed: October 17, 2007
    Publication date: May 1, 2008
    Inventors: Cheng Tay, Pek Tan, Swee Cheng, Eng Yap
  • METHOD AND APPARATUS FOR REDUCING ELECTRICAL INTERCONNECTION FATIGUE
    Publication number: 20070102817
    Abstract: A method and apparatus is provided that pertains to resisting crack initiation and propagation in electrical interconnections between components and substrates in ball grid array microelectronic packages. A hybrid of dielectric defined and non-dielectric defined electrical interconnects reduces the potential for electrical interconnection failure without having to control the dielectric defined interconnect ratio of substrates. In addition selective orientation of the dielectric defined edge portion of the electrical interconnect away from the point where cracks initiate resists crack propagation and component failure.
    Type: Application
    Filed: December 26, 2006
    Publication date: May 10, 2007
    Inventors: Cheng Tay, Swee Cheng, Eng Goh
  • Solder printing process to reduce void formation in a microvia
    Publication number: 20060091188
    Abstract: In one embodiment, a method is provided. The method comprises filling a microvia formed in a bond pad with solder paste comprising solder balls of the first size; and coating the bond pad with solder paste comprising solder balls of the second size, wherein the second size is greater than the first size.
    Type: Application
    Filed: October 29, 2004
    Publication date: May 4, 2006
    Inventors: Cheng Tay, Pek Tan, Swee Cheng, Eng Yap