Patents by Inventor Swee Har KHOR

Swee Har KHOR has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Reinforced semiconductor die and related methods
    Patent number: 11791288
    Abstract: Implementations of methods of forming a plurality of reinforced die may include forming a plurality of die on a substrate and patterning a metal gang frame to form a plurality of metal plates. The plurality of metal plates may correspond to the plurality of die. The method may include coupling the metal gang frame over the plurality of die and singulating the plurality of die. Each die of the plurality of die may include the corresponding metal plate from the plurality of metal plates coupled over the plurality of die.
    Type: Grant
    Filed: April 27, 2022
    Date of Patent: October 17, 2023
    Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Chee Hiong Chew, Erik Nino Tolentino, Yusheng Lin, Swee Har Khor
  • Semiconductor devices and methods of making the same
    Patent number: 11557530
    Abstract: In one embodiment, methods for making semiconductor devices are disclosed.
    Type: Grant
    Filed: June 17, 2020
    Date of Patent: January 17, 2023
    Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Swee Har Khor, Tian Hing Lim, Hui Min Ler, Chee Hiong Chew, Phillip Celaya
  • REINFORCED SEMICONDUCTOR DIE AND RELATED METHODS
    Publication number: 20220254734
    Abstract: Implementations of methods of forming a plurality of reinforced die may include forming a plurality of die on a substrate and patterning a metal gang frame to form a plurality of metal plates. The plurality of metal plates may correspond to the plurality of die. The method may include coupling the metal gang frame over the plurality of die and singulating the plurality of die. Each die of the plurality of die may include the corresponding metal plate from the plurality of metal plates coupled over the plurality of die.
    Type: Application
    Filed: April 27, 2022
    Publication date: August 11, 2022
    Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Chee Hiong CHEW, Erik Nino TOLENTINO, Yusheng LIN, Swee Har KHOR
  • Reinforced semiconductor die and related methods
    Patent number: 11348878
    Abstract: Implementations of methods of forming a plurality of reinforced die may include forming a plurality of die on a substrate and patterning a metal gang frame to form a plurality of metal plates. The plurality of metal plates may correspond to the plurality of die. The method may include coupling the metal gang frame over the plurality of die and singulating the plurality of die. Each die of the plurality of die may include the corresponding metal plate from the plurality of metal plates coupled over the plurality of die.
    Type: Grant
    Filed: May 28, 2020
    Date of Patent: May 31, 2022
    Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Erik Nino Tolentino, Chee Hiong Chew, Yusheng Lin, Swee Har Khor
  • SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME
    Publication number: 20200312749
    Abstract: In one embodiment, methods for making semiconductor devices are disclosed.
    Type: Application
    Filed: June 17, 2020
    Publication date: October 1, 2020
    Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Swee Har KHOR, Tian Hing LIM, Hui Min LER, Chee Hiong CHEW, Phillip CELAYA
  • REINFORCED SEMICONDUCTOR DIE AND RELATED METHODS
    Publication number: 20200294935
    Abstract: Implementations of methods of forming a plurality of reinforced die may include forming a plurality of die on a substrate and patterning a metal gang frame to form a plurality of metal plates. The plurality of metal plates may correspond to the plurality of die. The method may include coupling the metal gang frame over the plurality of die and singulating the plurality of die. Each die of the plurality of die may include the corresponding metal plate from the plurality of metal plates coupled over the plurality of die.
    Type: Application
    Filed: May 28, 2020
    Publication date: September 17, 2020
    Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Erik Nino TOLENTINO, Chee Hiong CHEW, Yusheng LIN, Swee Har KHOR
  • Semiconductor devices and methods of making the same
    Patent number: 10727170
    Abstract: In one embodiment, methods for making semiconductor devices are disclosed.
    Type: Grant
    Filed: September 1, 2015
    Date of Patent: July 28, 2020
    Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Swee Har Khor, Tian Hing Lim, Hui Min Ler, Chee Hiong Chew, Phillip Celaya
  • Reinforced semiconductor die and related methods
    Patent number: 10700018
    Abstract: Implementations of methods of forming a plurality of reinforced die may include forming a plurality of die on a substrate and patterning a metal gang frame to form a plurality of metal plates. The plurality of metal plates may correspond to the plurality of die. The method may include coupling the metal gang frame over the plurality of die and singulating the plurality of die. Each die of the plurality of die may include the corresponding metal plate from the plurality of metal plates coupled over the plurality of die.
    Type: Grant
    Filed: November 6, 2018
    Date of Patent: June 30, 2020
    Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Erik Nino Tolentino, Chee Hiong Chew, Yusheng Lin, Swee Har Khor
  • REINFORCED SEMICONDUCTOR DIE AND RELATED METHODS
    Publication number: 20200144200
    Abstract: Implementations of methods of forming a plurality of reinforced die may include forming a plurality of die on a substrate and patterning a metal gang frame to form a plurality of metal plates. The plurality of metal plates may correspond to the plurality of die. The method may include coupling the metal gang frame over the plurality of die and singulating the plurality of die. Each die of the plurality of die may include the corresponding metal plate from the plurality of metal plates coupled over the plurality of die.
    Type: Application
    Filed: November 6, 2018
    Publication date: May 7, 2020
    Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Erik Nino TOLENTINO, Chee Hiong CHEW, Yusheng LIN, Swee Har KHOR
  • SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME
    Publication number: 20170062310
    Abstract: In one embodiment, methods for making semiconductor devices are disclosed.
    Type: Application
    Filed: September 1, 2015
    Publication date: March 2, 2017
    Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Swee Har KHOR, Tian Hing LIM, Hui Min LER, Chee Hiong CHEW, Phillip CELAYA