Patents by Inventor Swee Kat Lee

Swee Kat Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor packages and methods for manufacturing thereof
    Patent number: 12300559
    Abstract: A package includes a dielectric carrier, an electronic component mounted on the dielectric carrier, and an encapsulant encapsulating at least part of the dielectric carrier and the electronic component. Corresponding methods of manufacturing the package are also described.
    Type: Grant
    Filed: December 16, 2021
    Date of Patent: May 13, 2025
    Assignee: Infineon Technologies AG
    Inventors: Si Hao Vincent Yeo, Chan Lam Cha, Ying Dieh Cheong, Chau Fatt Chiang, Cher Hau Danny Koh, Wern Ken Daryl Wee, Swee Kat Lee, Desmond Jenn Yong Loo, Fortunato Lopez, Norliza Morban, Khay Chwan Andrew Saw, Sock Chien Tey, Mei Yong Wang