Patents by Inventor Swee Kwong Mok

Swee Kwong Mok has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • APPARATUS FOR MOLDING ELECTRONIC COMPONENT
    Publication number: 20140295013
    Abstract: A molding apparatus for an electronic device comprises a first mold chase, a second mold chase and a middle plate which is configured to be clamped together with the electronic device between the first mold chase and second mold chase during molding. A molding cavity formed in the middle plate is configured for receiving molding compound. A package pin is mounted on the middle plate to be movable with the middle plate, and a portion of the package pin is positioned to protrude into the molding cavity to form a mark in the molding compound when molding compound is molded around the said portion of the package pin.
    Type: Application
    Filed: June 16, 2014
    Publication date: October 2, 2014
    Inventors: Shu Chuen HO, Si Liang LU, Swee Kwong MOK, Kar Weng YAN
  • Apparatus for molding electronic components
    Patent number: 8794952
    Abstract: A molding apparatus for an electronic device comprises a first mold chase, a second mold chase and a middle plate which is configured to be clamped together with the electronic device between the first mold chase and second mold chase during molding. A molding cavity formed in the middle plate is configured for receiving molding compound. A package pin is mounted on the middle plate to be movable with the middle plate, and a portion of the package pin is positioned to protrude into the molding cavity to form a mark in the molding compound when molding compound is molded around the said portion of the package pin.
    Type: Grant
    Filed: February 28, 2011
    Date of Patent: August 5, 2014
    Assignee: ASM Technology Singapore Pte Ltd
    Inventors: Shu Chuen Ho, Si Liang Lu, Swee Kwong Mok, Kar Weng Yan
  • Runner system for supplying molding compound
    Patent number: 8292613
    Abstract: A runner system for a molding apparatus comprises a plurality of runner networks, each runner network further comprising a mold supply pot having a first side and a second side opposite to the first side. A plurality of molding cavities are located on the first and second sides of the mold supply pot, and a plurality of runners are operative to channel molding compound from each mold supply pot to the plurality of molding cavities. At least one of the mold supply pots comprises a different number of runners located on the first side which are connected to the mold supply pot as compared to a number of runners located on the second side which are connected to the mold supply pot.
    Type: Grant
    Filed: February 28, 2011
    Date of Patent: October 23, 2012
    Assignee: ASM Technology Singapore Pte Ltd
    Inventors: Shu Chuen Ho, Si Liang Lu, Swee Kwong Mok, Kar Weng Yan
  • RUNNER SYSTEM FOR SUPPLYING MOLDING COMPOUND
    Publication number: 20110212214
    Abstract: A runner system for a molding apparatus comprises a plurality of runner networks, each runner network further comprising a mold supply pot having a first side and a second side opposite to the first side. A plurality of molding cavities are located on the first and second sides of the mold supply pot, and a plurality of runners are operative to channel molding compound from each mold supply pot to the plurality of molding cavities. At least one of the mold supply pots comprises a different number of runners located on the first side which are connected to the mold supply pot as compared to a number of runners located on the second side which are connected to the mold supply pot.
    Type: Application
    Filed: February 28, 2011
    Publication date: September 1, 2011
    Inventors: Shu Chuen HO, Si Liang LU, Swee Kwong MOK, Kar Weng YAN
  • APPARATUS FOR MOLDING ELECTRONIC COMPONENTS
    Publication number: 20110210477
    Abstract: A molding apparatus for an electronic device comprises a first mold chase, a second mold chase and a middle plate which is configured to be clamped together with the electronic device between the first mold chase and second mold chase during molding. A molding cavity formed in the middle plate is configured for receiving molding compound. A package pin is mounted on the middle plate to be movable with the middle plate, and a portion of the package pin is positioned to protrude into the molding cavity to form a mark in the molding compound when molding compound is molded around the said portion of the package pin.
    Type: Application
    Filed: February 28, 2011
    Publication date: September 1, 2011
    Inventors: Shu Chuen HO, Si Liang LU, Swee Kwong MOK, Kar Weng YAN