Patents by Inventor Swee Peng Lee

Swee Peng Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and system for aligning IC die to package substrate
    Patent number: 7052968
    Abstract: In a method and system for placing an IC (integrated circuit) die onto a package substrate, a first reference is determined after locating a first fiducial on the package substrate, and a second reference is determined after locating a second fiducial on the package substrate. The IC die is placed onto the package substrate to be aligned with respect to the first and second references of the first and second fiducials that are comprised of a plurality of markings such as a plurality of dots.
    Type: Grant
    Filed: April 7, 2004
    Date of Patent: May 30, 2006
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Swee Peng Lee, Ajit Dubey
  • Inspection for alignment between IC die and package substrate
    Patent number: 7030772
    Abstract: In a method and system for inspecting alignment between an IC (integrated circuit) die and a package substrate, a plurality of fiducials are located on the package substrate for determining a plurality of references. A center point of the package substrate is determined from the plurality of references. In addition, whether a center point of the IC die is aligned to the center point of the package substrate within an acceptable range is determined.
    Type: Grant
    Filed: April 7, 2004
    Date of Patent: April 18, 2006
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Swee Peng Lee, Ajit Dubey, Leang Hua Kam, Loo Kean Teoh