Patents by Inventor Swezin Than TUN

Swezin Than TUN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12146051
    Abstract: An epoxy resin composition is provided which includes a poly-naphthalene-based epoxy resin having two or more epoxy groups per molecule combined with a non-linear multi-phenyl epoxy resin and an additional epoxy resin having an epoxy functionality of 3 or more, as well as a prepreg, and a fiber-reinforced composite material prepared using the epoxy resin composition. More specifically, an epoxy resin composition is provided which contains a combination of particular types of epoxy resins and curatives that, when cured, provides high flexural modulus and that is suitable for preparing a fiber-reinforced composite material capable of withstanding extreme use environments such as low-temperature environments and high-temperature moisture-absorbing environments. In addition, epoxy resin systems are provided which are capable of achieving a high Tg along with good thermal stability for long periods of time at elevated temperatures (e.g., 180° C. or more) when cured at 210° C. for 2 hours.
    Type: Grant
    Filed: September 20, 2019
    Date of Patent: November 19, 2024
    Assignee: Toray Industries, Inc.
    Inventors: Swezin Than Tun, Jonathan Hughes, Nobuyuki Arai
  • Publication number: 20220033640
    Abstract: An epoxy resin composition is provided which includes a poly-naphthalene-based epoxy resin having two or more epoxy groups per molecule combined with a non-linear multi-phenyl epoxy resin and an additional epoxy resin having an epoxy functionality of 3 or more, as well as a prepreg, and a fiber-reinforced composite material prepared using the epoxy resin composition. More specifically, an epoxy resin composition is provided which contains a combination of particular types of epoxy resins and curatives that, when cured, provides high flexural modulus and that is suitable for preparing a fiber-reinforced composite material capable of withstanding extreme use environments such as low-temperature environments and high-temperature moisture-absorbing environments. In addition, epoxy resin systems are provided which are capable of achieving a high Tg along with good thermal stability for long periods of time at elevated temperatures (e.g., 180° C. or more) when cured at 210° C. for 2 hours.
    Type: Application
    Filed: September 20, 2019
    Publication date: February 3, 2022
    Applicant: Toray Industries, Inc.
    Inventors: Swezin Than Tun, Jonathan Hughes, Nobuyuki Arai
  • Publication number: 20210269635
    Abstract: This invention relates to an epoxy resin composition for fiber-reinforced composite materials, which contains the following constituent components (A), (B), and (C). Component (A) contains at least one poly-naphthalene-based epoxy resin, component (B) contains at least one alicyclic epoxy resin and/or a divinylarene diepoxide resin, and component (C) contains at least one amine curing agent. This epoxy resin composition, containing a specific combination of particular types of epoxy resin and curatives, provides high heat resistance and high flexural modulus under extreme environmental conditions. More particularly, a cured resin prepared by the epoxy resin composition offers well balanced mechanical properties that are suitable for preparing fiber-reinforced composite materials useful in aircraft components, spacecraft components, automobile components, artificial satellites components, industrial components, and the like.
    Type: Application
    Filed: September 20, 2019
    Publication date: September 2, 2021
    Applicant: Toray Industries, Inc.
    Inventors: Swezin Than Tun, Jonathan Hughes, Nobuyuki Arai
  • Patent number: 10829633
    Abstract: An epoxy resin composition for a fiber-reinforced composite material, containing at least components [A], [B], [C], [D], and [E], wherein the epoxy resin composition when cured has a glass transition temperature greater than 220° C. and a storage modulus, as defined by a specific method, less than 35 MPa, as determined from an elastic shear modulus measured at a temperature of at least 35° C. higher than the glass transition temperature, wherein the components [A], [B], [C], [D], and [E] are: [A] at least one naphthalene-based epoxy resin having an EEW between 190 and 260 g/mol; [B] at least one epoxy resin having a functionality of three or more; [C] at least one amine curing agent; [D] at least one latent acid catalyst; and [E] at least one cycloaliphatic epoxy resin. This epoxy resin composition is useful in the molding of fiber-reinforced composite materials.
    Type: Grant
    Filed: October 19, 2017
    Date of Patent: November 10, 2020
    Assignee: Toray Industries, Inc.
    Inventors: Benjamin Lehman, Jonathan Hughes, Swezin Than Tun, Nobuyuki Arai
  • Publication number: 20200048453
    Abstract: An epoxy resin composition for a fiber-reinforced composite material, containing at least components [A], [B], [C], [D], and [E], wherein the epoxy resin composition when cured has a glass transition temperature greater than 220° C. and a storage modulus, as defined by a specific method, less than 35 MPa, as determined from an elastic shear modulus measured at a temperature of at least 35° C. higher than the glass transition temperature, wherein the components [A], [B], [C], [D], and [E] are: [A] at least one naphthalene-based epoxy resin having an EEW between 190 and 260 g/mol; [B] at least one epoxy resin having a functionality of three or more; [C] at least one amine curing agent; [D] at least one latent acid catalyst; and [E] at least one cycloaliphatic epoxy resin. This epoxy resin composition is useful in the molding of fiber-reinforced composite materials.
    Type: Application
    Filed: October 19, 2017
    Publication date: February 13, 2020
    Applicant: Toray Industries, Inc.
    Inventors: Benjamin Lehman, Jonathan Hughes, Swezin Than Tun, Nobuyuki Arai
  • Publication number: 20190169356
    Abstract: The embodiments herein relate to an epoxy resin composition containing a specific type of amine-based epoxy resin containing four epoxy groups per molecule, a prepreg, and a fiber-reinforced composite material. More specifically, the embodiments herein relate to an epoxy resin composition containing a combination of particular types of epoxy resin and curatives that provides high flexural modulus that is suitable for preparing a fiber-reinforced composite material capable of withstanding extreme use environments such as low-temperature environments and high-temperature moisture-absorbing environments. In addition, the embodiments herein relate to epoxy resin systems capable of achieving a high degree of cure (e.g., 85% or more) within a relatively short period of time (e.g., less than two hours) at a relatively low temperature (e.g., 132° C.).
    Type: Application
    Filed: August 24, 2017
    Publication date: June 6, 2019
    Applicant: Toray Industries, Inc.
    Inventors: Swezin Than Tun, Jonathan Hughes, Nobuyuki Arai, Benjamin Lehman
  • Patent number: 9688891
    Abstract: A fiber reinforced polymer composition is provided comprising a fiber and an adhesive composition, wherein the adhesive composition comprises at least a thermosetting resin, a curing agent, and a hard interfacial material. When cured, the adhesive composition forms good bonds to the reinforcing fiber, and an interfacial region between the reinforcing fiber and the adhesive composition is formed which comprises the hard interfacial material. Additional embodiments include a prepreg and a method of manufacturing a composite article by curing the adhesive composition and the reinforcing fiber.
    Type: Grant
    Filed: December 23, 2013
    Date of Patent: June 27, 2017
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Felix N. Nguyen, Kenichi Yoshioka, Swezin Than Tun, Alfred P. Haro
  • Publication number: 20150315430
    Abstract: A fiber reinforced polymer composition is provided comprising a fiber and an adhesive composition, wherein the adhesive composition comprises at least a thermosetting resin, a curing agent, and a hard interfacial material. When cured, the adhesive composition forms good bonds to the reinforcing fiber, and an interfacial region between the reinforcing fiber and the adhesive composition is formed which comprises the hard interfacial material. Additional embodiments include a prepreg and a method of manufacturing a composite article by curing the adhesive composition and the reinforcing fiber.
    Type: Application
    Filed: December 23, 2013
    Publication date: November 5, 2015
    Applicant: Toray Industries, Inc.
    Inventors: Felix N. NGUYEN, Kenichi YOSHIOKA, Swezin Than TUN, Alfred P. HARO