Abstract: A computer peripheral device with an integral ground clip. In one embodiment, the present invention includes a substrate. The substrate has a ground signal receptacle location coupled thereto. The present embodiment further includes an enclosure which adapted to be coupled to the substrate. In this embodiment, the enclosure has a conductive region coupled thereto. The enclosure further includes a grounding member which is integral therewith. The grounding member is disposed such that the grounding member is electrically coupled to the ground signal receptacle location when the enclosure is assembled to the substrate. In so doing, the present invention provides a computer peripheral device which, among other benefits, effectively dissipates ground signals.