Abstract: A cloud center infrastructure system may include a service aggregator connected directly to a provider network. The service aggregator may be configured to receive, via the provider network, a data unit from a customer device, associated with a customer; identify a first device, associated with a first traffic processing service, based on a sequence of traffic processing services associated with the customer; and send the data unit to the first device, wherein the first device is located in a cloud services center, and wherein the first device is connected to the service aggregator over a Layer 2 connection.

Abstract: A system and method in accordance with exemplary embodiments may receive, from a management system, configuration data associated with a management protocol. In addition, the system and method may generate test data traffic at least based on the configuration data. Further, the system and method may transmit, to one or more network elements, the test data traffic. Even further, the system and method may receive, from the management system, a query associated with the management protocol that requests data traffic information associated with at least one of the generated test data traffic, transmitted test data traffic, and received test data traffic. The system and method may transmit, to the management system, the requested data traffic information in response to the query.

Abstract: A network device may be configured to define a Layer 2 domain, wherein the Layer 2 domain defines a data link layer broadcast domain and assign an access interface to the Layer 2 domain. The network device may be further configured to assign a double Virtual Local Area Network (VLAN) identifier to the access interface in the Layer 2 domain, wherein the double VLAN identifier includes an inner VLAN identifier and an outer VLAN identifier, receive a data unit via the access interface, wherein the data unit includes the double VLAN identifier, and associate the data unit with the defined Layer 2 domain, based on the data unit being received via the access interface and based on the data unit including the assigned double VLAN identifier.

Abstract: A cloud center infrastructure system may include a service aggregator connected directly to a provider network. The service aggregator may be configured to receive, via the provider network, a data unit from a customer device, associated with a customer; identify a first device, associated with a first traffic processing service, based on a sequence of traffic processing services associated with the customer; and send the data unit to the first device, wherein the first device is located in a cloud services center, and wherein the first device is connected to the service aggregator over a Layer 2 connection.

Abstract: An integrally molded carbon canister is provided. The integrally molded carbon canister includes a housing including four external side walls and an upper portion at least partially enclosing an internal cavity connected to a vapor inlet and outlet port, the upper portion including a depressed flow disruptor positioned rearward of an injection gate, and a first and second projected flow channel positioned adjacent to the injection gate and laterally spanning the housing. The depressed flow disruptor has a thickness that is less than a section of the upper portion surrounding the depressed flow disruptor and the projected flow channels have a thickness that is greater than a section of the upper portion surrounding the projected flow channels.

Abstract: An integrally molded carbon canister is provided. The integrally molded carbon canister includes a housing including four external side walls and an upper portion at least partially enclosing an internal cavity connected to a vapor inlet and outlet port, the upper portion including a depressed flow disruptor positioned rearward of an injection gate, and a first and second projected flow channel positioned adjacent to the injection gate and laterally spanning the housing.

Abstract: A crude oil feedstream is treated to remove or reduce the content of known undesired heteroatomic and polynuclear aromatic compounds containing nitrogen and sulfur by contacting the feedstream with one or more solid adsorbent materials selected from attapulgus clay, alumina, silica gel and activated carbon in a mixing vessel for a time that is sufficient to optimize the adsorption of the undesired compounds from the crude oil, subjecting the mixture to atmospheric flash distillation and then to vacuum flash distillation to recover presorbed boiling ranges of products having a lowered content of the undesired compounds, and preferably regenerating at least a portion of the solid adsorbent material for reuse in the process.

Abstract: A system and method in accordance with exemplary embodiments may receive, from a management system, configuration data associated with a management protocol. In addition, the system and method may generate test data traffic at least based on the configuration data. Further, the system and method may transmit, to one or more network elements, the test data traffic. Even further, the system and method may receive, from the management system, a query associated with the management protocol that requests data traffic information associated with at least one of the generated test data traffic, transmitted test data traffic, and received test data traffic. The system and method may transmit, to the management system, the requested data traffic information in response to the query.

Abstract: A crude oil feedstream is treated to remove or reduce the content of known undesired heteroatomic and polynuclear aromatic compounds containing nitrogen and sulfur by contacting the feedstream with one or more solid adsorbent materials selected from attapulgus clay, alumina, silica gel and activated carbon in a mixing vessel for a time that is sufficient to optimize the adsorption of the undesired compounds from the crude oil, subjecting the mixture to atmospheric flash distillation and then to vacuum flash distillation to recover presorbed boiling ranges of products having a lowered content of the undesired compounds, and preferably regenerating at least a portion of the solid adsorbent material for reuse in the process.

Abstract: Methods for forming vias are disclosed. The methods include providing a substrate having a first surface and an opposing, second surface. The vias are formed within the substrate to have a longitudinal axis sloped at an angle with respect to a reference line extending perpendicular to the first surface and the second surface of the substrate. The vias may be formed from the first surface to the opposing second surface, or the via may be formed as a first blind opening from the first surface, then a second opening may be formed from the second surface to be aligned with the first opening. Vias may be formed completely through a first substrate and a second substrate, and the substrates may be bonded together. Semiconductor devices including the vias of the present invention are also disclosed. A method of forming spring-like contacts is also disclosed.

Abstract: Methods for forming vias are disclosed. The methods include providing a substrate having a first surface and an opposing, second surface. The vias are formed within the substrate to have a longitudinal axis sloped at an angle with respect to a reference line extending perpendicular to the first surface and the second surface of the substrate. The vias may be formed from the first surface to the opposing second surface, or the via may be formed as a first blind opening from the first surface, then a second opening may be formed from the second surface to be aligned with the first opening. Vias may be formed completely through a first substrate and a second substrate, and the substrates may be bonded together. Semiconductor devices including the vias of the present invention are also disclosed. A method of forming spring-like contacts is also disclosed.

Abstract: Collars, support structures, or forms for protruding conductive structures include apertures or receptacles through which the conductive structure may extend. The aperture or receptacle may be configured to contact a surface of the conductive structure, and even to define a shape of at least a portion of the conductive structure. Each collar, support structure, or form may include a plurality of adjacent, mutually adhered regions.

Abstract: Methods of manufacturing semiconductor devices using permanent or temporary polymer layers having apertures to expose contact pads and cover the active surfaces of the semiconductor devices.

Abstract: One or more stabilizers are disposed on the surface of a semiconductor device component prior to bonding the same to a higher-level substrate. The one or more stabilizers may be formed on or secured to the surface. Upon assembly of the semiconductor device component face down upon a higher-level substrate and joining conductive structures between the contact pads of the semiconductor device component and corresponding contact pads of the higher-level substrate, the stabilizers at least partially stabilize the semiconductor device component on the higher-level substrate to maintain a substantially parallel relation therebetween. The stabilizers can also be positioned and configured to define a minimum, substantially uniform distance between the semiconductor device component and the higher-level substrate.

Abstract: The present invention is directed to a method of attaching a leadframe to a singulated good die using a wet film adhesive applied in a predetermined pattern on the active surface of the good die, the lead finger of a leadframe, or both. By applying the adhesive only to identified good dice, time and material are saved over a process that applies adhesive to the entire wafer. By attaching the leadframe to the good die with a wet film, it is possible to remove the leadframe from the good die for rework if the good die subsequently tests unacceptable.

Abstract: Methods for fabricating carrier substrates and other semiconductor device components include disposing a collar around at least a portion of a contact. The collar may be formed by a programmed material consolidation process. The programmed material consolidation process may be effected in conjunction with a feature recognition technique, such as machine vision. Once one or more collars are in place, the semiconductor device component may be electrically connected to another semiconductor device component.

Abstract: Apparatus for detecting move instructions in which only registers are involved. The apparatus generates signals to disable the inclusion of any SIB byte, displacement bytes and immediate bytes from the instruction length when a move instruction which only requires processor registers is encountered. The apparatus uses the generated signals for instruction length calculation and instruction prefetch pointer generation.