Patents by Inventor Syed A. Alam

Syed A. Alam has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100219155
    Abstract: Etching equipment and methods are disclosed herein for more efficient etching of sacrificial material from between permanent MEMS structures. An etching head includes an elongate etchant inlet structure, which may be slot-shaped or an elongate distribution of inlet holes. A substrate is supported in proximity to the etching head in a manner that defines a flow path substantially parallel to the substrate face, and permits relative motion for the etching head to scan across the substrate.
    Type: Application
    Filed: February 18, 2008
    Publication date: September 2, 2010
    Applicant: QUALCOMM MEMS TECHNOLOGIES, INC.
    Inventors: Khurshid Syed Alam, Evgeni Gousev, Marc Maurice Mignard, David Heald, Ana R. Londergan, Philip Don Floyd
  • Publication number: 20080042140
    Abstract: A three dimensional (3D) integrated circuit (IC), 3D IC chip and method of fabricating a 3D IC chip. The chip includes multiple layers of circuits, e.g., silicon insulator (SOI) CMOS IC layers, each including circuit elements. The layers may be formed in parallel and one layer attached to another to form a laminated 3D chip.
    Type: Application
    Filed: August 30, 2007
    Publication date: February 21, 2008
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPERATION
    Inventors: Syed Alam, Ibrahim Elfadel, Kathryn Guarini, Meikei Ieong, Prabhakar Kudva, David Kung, Mark Lavin, Arifur Rahman
  • Publication number: 20070287224
    Abstract: A three dimensional (3D) integrated circuit (IC), 3D IC chip and method of fabricating a 3D IC chip. The chip includes multiple layers of circuits, e.g., silicon insulator (SOI) CMOS IC layers, each including circuit elements. The layers may be formed in parallel and one layer attached to another to form a laminated 3D chip.
    Type: Application
    Filed: April 19, 2007
    Publication date: December 13, 2007
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPERATION
    Inventors: Syed Alam, Ibrahim Elfadel, Kathryn Guarini, Meikei Ieong, Prabhakar Kudva, David Kung, Mark Lavin, Arifur Rahman
  • Publication number: 20070057384
    Abstract: A reciprocal design symmetry allows stacked wafers or die on wafer to use identical designs or designs that vary only by a few layers (e.g. metal interconnect layers). Flipping or rotating one die or wafer allows the stacked die to have a reciprocal orientation with respect to each other which may be used to decrease the interconnect required between the vertically stacked die and or wafers. Flipping and/or rotating may also be used to improve heat dissipation when wafer and/or die are stacked. The stacked wafers or die may then be packaged.
    Type: Application
    Filed: September 14, 2005
    Publication date: March 15, 2007
    Inventors: Syed Alam, Robert Jones, Scott Pozder
  • Publication number: 20060033110
    Abstract: A three dimensional (3D) integrated circuit (IC), 3D IC chip and method of fabricating a 3D IC chip. The chip includes multiple layers of circuits, e.g., silicon insulator (SOI) CMOS IC layers, each including circuit elements. The layers may be formed in parallel and one layer attached to another to form a laminated 3D chip.
    Type: Application
    Filed: August 16, 2004
    Publication date: February 16, 2006
    Inventors: Syed Alam, Ibrahim Elfadel, Kathryn Guarini, Meikei Ieong, Prabhakar Kudva, David Kung, Mark Lavin, Arifur Rahman