Abstract: A method collects and presents hierarchical data. The method includes receiving objective user inputs applied to a set of objective objects of a set of objects, receiving topic user inputs applied to a set of topic objects of the set of objects, and receiving settlement user inputs applied to a set of settlement objects of the set of objects. The method further includes applying a guidance categorization model to a guidance object of the set of topic objects to a generate a guidance label for the guidance object, applying a blocker categorization model to a blocker object of the set of topic objects to generate a blocker label for the blocker object, and applying a diagram metrics model to the set of objects to generate diagram metrics data. The method further includes presenting a topic diagram using the guidance label, the blocker label, and the diagram metrics data.

Abstract: A capacitive touch panel is tested for the presence or absence of short and open circuits in drive and sense lines without the use of a tool that touches the surface of the panel. During a first stage of testing, drive lines of the touch panel are sequentially driven while the remaining drive lines are floated. Sense lines are read to indicate whether a driven drive line is shorted to an adjacent drive line, an open circuit, or coupled to a sense line that is an open circuit. During a second stage of testing, drive lines are driven while alternate sense lines are floated or enabled. The signals on the enabled sense lines are acquired to indicate whether the enabled sense lines are shorted to adjacent sense lines. This second stage can be repeated, switching the roles of the sense lines, to determine the locations of short and/or open circuits.

Abstract: An integrally molded carbon canister is provided. The integrally molded carbon canister includes a housing including four external side walls and an upper portion at least partially enclosing an internal cavity connected to a vapor inlet and outlet port, the upper portion including a depressed flow disruptor positioned rearward of an injection gate, and a first and second projected flow channel positioned adjacent to the injection gate and laterally spanning the housing. The depressed flow disruptor has a thickness that is less than a section of the upper portion surrounding the depressed flow disruptor and the projected flow channels have a thickness that is greater than a section of the upper portion surrounding the projected flow channels.

Abstract: An integrally molded carbon canister is provided. The integrally molded carbon canister includes a housing including four external side walls and an upper portion at least partially enclosing an internal cavity connected to a vapor inlet and outlet port, the upper portion including a depressed flow disruptor positioned rearward of an injection gate, and a first and second projected flow channel positioned adjacent to the injection gate and laterally spanning the housing.

Abstract: A crude oil feedstream is treated to remove or reduce the content of known undesired heteroatomic and polynuclear aromatic compounds containing nitrogen and sulfur by contacting the feedstream with one or more solid adsorbent materials selected from attapulgus clay, alumina, silica gel and activated carbon in a mixing vessel for a time that is sufficient to optimize the adsorption of the undesired compounds from the crude oil, subjecting the mixture to atmospheric flash distillation and then to vacuum flash distillation to recover presorbed boiling ranges of products having a lowered content of the undesired compounds, and preferably regenerating at least a portion of the solid adsorbent material for reuse in the process.

Abstract: A crude oil feedstream is treated to remove or reduce the content of known undesired heteroatomic and polynuclear aromatic compounds containing nitrogen and sulfur by contacting the feedstream with one or more solid adsorbent materials selected from attapulgus clay, alumina, silica gel and activated carbon in a mixing vessel for a time that is sufficient to optimize the adsorption of the undesired compounds from the crude oil, subjecting the mixture to atmospheric flash distillation and then to vacuum flash distillation to recover presorbed boiling ranges of products having a lowered content of the undesired compounds, and preferably regenerating at least a portion of the solid adsorbent material for reuse in the process.

Abstract: Methods for forming vias are disclosed. The methods include providing a substrate having a first surface and an opposing, second surface. The vias are formed within the substrate to have a longitudinal axis sloped at an angle with respect to a reference line extending perpendicular to the first surface and the second surface of the substrate. The vias may be formed from the first surface to the opposing second surface, or the via may be formed as a first blind opening from the first surface, then a second opening may be formed from the second surface to be aligned with the first opening. Vias may be formed completely through a first substrate and a second substrate, and the substrates may be bonded together. Semiconductor devices including the vias of the present invention are also disclosed. A method of forming spring-like contacts is also disclosed.

Abstract: Methods for forming vias are disclosed. The methods include providing a substrate having a first surface and an opposing, second surface. The vias are formed within the substrate to have a longitudinal axis sloped at an angle with respect to a reference line extending perpendicular to the first surface and the second surface of the substrate. The vias may be formed from the first surface to the opposing second surface, or the via may be formed as a first blind opening from the first surface, then a second opening may be formed from the second surface to be aligned with the first opening. Vias may be formed completely through a first substrate and a second substrate, and the substrates may be bonded together. Semiconductor devices including the vias of the present invention are also disclosed. A method of forming spring-like contacts is also disclosed.

Abstract: Collars, support structures, or forms for protruding conductive structures include apertures or receptacles through which the conductive structure may extend. The aperture or receptacle may be configured to contact a surface of the conductive structure, and even to define a shape of at least a portion of the conductive structure. Each collar, support structure, or form may include a plurality of adjacent, mutually adhered regions.

Abstract: Methods of manufacturing semiconductor devices using permanent or temporary polymer layers having apertures to expose contact pads and cover the active surfaces of the semiconductor devices.

Abstract: One or more stabilizers are disposed on the surface of a semiconductor device component prior to bonding the same to a higher-level substrate. The one or more stabilizers may be formed on or secured to the surface. Upon assembly of the semiconductor device component face down upon a higher-level substrate and joining conductive structures between the contact pads of the semiconductor device component and corresponding contact pads of the higher-level substrate, the stabilizers at least partially stabilize the semiconductor device component on the higher-level substrate to maintain a substantially parallel relation therebetween. The stabilizers can also be positioned and configured to define a minimum, substantially uniform distance between the semiconductor device component and the higher-level substrate.

Abstract: The present invention is directed to a method of attaching a leadframe to a singulated good die using a wet film adhesive applied in a predetermined pattern on the active surface of the good die, the lead finger of a leadframe, or both. By applying the adhesive only to identified good dice, time and material are saved over a process that applies adhesive to the entire wafer. By attaching the leadframe to the good die with a wet film, it is possible to remove the leadframe from the good die for rework if the good die subsequently tests unacceptable.

Abstract: Methods for fabricating carrier substrates and other semiconductor device components include disposing a collar around at least a portion of a contact. The collar may be formed by a programmed material consolidation process. The programmed material consolidation process may be effected in conjunction with a feature recognition technique, such as machine vision. Once one or more collars are in place, the semiconductor device component may be electrically connected to another semiconductor device component.

Abstract: Apparatus for detecting move instructions in which only registers are involved. The apparatus generates signals to disable the inclusion of any SIB byte, displacement bytes and immediate bytes from the instruction length when a move instruction which only requires processor registers is encountered. The apparatus uses the generated signals for instruction length calculation and instruction prefetch pointer generation.