Patents by Inventor Syed N. Sarwar

Syed N. Sarwar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7199039
    Abstract: Circuit edits may be performed through the back side of an integrated circuit die. In one embodiment, a circuit edit is achieved by exposing first and second circuit edit connection targets through a semiconductor substrate of the integrated circuit die from the back side. An insulating layer is not deposited over the first and second circuit edit connection targets and the exposed semiconductor substrate. Next, a conductor is deposited over the circuit edit connection targets from the back side of the integrated circuit to couple together the circuit edit connection targets.
    Type: Grant
    Filed: May 19, 2003
    Date of Patent: April 3, 2007
    Assignee: Intel Corporation
    Inventors: Sailesh C. Suthar, Paul J. Hack, Syed N. Sarwar
  • Publication number: 20040232414
    Abstract: Circuit edits may be performed through the back side of an integrated circuit die. In one embodiment, a circuit edit is achieved by exposing first and second circuit edit connection targets through a semiconductor substrate of the integrated circuit die from the back side. An insulating layer is not deposited over the first and second circuit edit connection targets and the exposed semiconductor substrate. Next, a conductor is deposited over the circuit edit connection targets from the back side of the integrated circuit to couple together the circuit edit connection targets.
    Type: Application
    Filed: May 19, 2003
    Publication date: November 25, 2004
    Inventors: Sailesh C. Suthar, Paul J. Hack, Syed N. Sarwar