Abstract: An automatic wood flooring boards reparation device for applying and spreading filler over boards is provided, the device comprising an infeed unit, an outfeed unit and a filler applicator. The filler applicator applies filler over a top surface of the boards with a head comprising a main body, a spreading device and a bottom portion, each part comprising an opening for distributing filler over the board and an opening for securing a scrapper for spreading the applied filler. A tight seal is created between a filler applicator opening of the bottom portion and the top surface of the boards to avoid overspill of filler. A method for applying filler is also provided.

Abstract: A tie layer for bonding a ceramic or metallic coating to a thermoplastic substrate is described. The tie layer comprises from 2 to 70% ceramic and/or metallic filler particles in a thermoplastic matrix. The thermoplastic matrix is compatible with the thermoplastic substrate. Further, a method of bonding a ceramic or metallic coating to a thermoplastic substrate is disclosed. The method involves applying the tie layer to the substrate, and bonding the ceramic or metallic coating to the tie layer using a coating process that consolidates the substrate, the tie layer and the coating. The tie layer and process are useful in coating implantable prosthetic bones, or coating industrial items used in automotive, aeronautical or medical industries.