Abstract: There is described an optical pressure sensor comprising a sensor housing and an optical pressure cell mounted within the sensor housing and dividing the sensor housing into a first fluid space and a second fluid space. The optical pressure cell comprises a front side exposed to a pressure in the first fluid space and a back side exposed to a pressure in the second fluid space. The optical pressure sensor further comprises a fluid communication arrangement allowing pressure equalization between the pressure in the first fluid space on the front side and the pressure in the second fluid space on the back side of the optical pressure cell.

Abstract: There is described an optical pressure sensor comprising a sensor housing and an optical pressure cell mounted within the sensor housing and dividing the sensor housing into a first fluid space and a second fluid space. The optical pressure cell comprises a front side exposed to a pressure in the first fluid space and a back side exposed to a pressure in the second fluid space. The optical pressure sensor further comprises a fluid communication arrangement allowing pressure equalization between the pressure in the first fluid space on the front side and the pressure in the second fluid space on the back side of the optical pressure cell.

Abstract: The invention provides a miniature robust fiber optic pressure sensor. The miniature fiber optic sensor comprises a Fabry-Perot chip bonded to an optical fiber. The invention provides a new sensor design that reduces the amount of adhesive required to bond the optical fiber to the Fabry-Perot sensor such that the sensor is less sensitive to moisture. The invention also provides manufacturing methods of the sensor comprising a method based on etching and a method based on using an excimer laser. The invention also provides a chip design that renders the chip less sensitive to thermal changes. The invention also provides a chip design in which a sensor diaphragm has a well-defined thickness. The invention also provides a chip design that protects the chip from etching.

Abstract: A method to assemble optical fiber devices and a fiber optic sensor is provided. It features a small adhesive joint between the fiber and a capillary tube by means of a small recess carved on the side of the fiber. This recess acts as a reservoir for the adhesive during the insertion of the fiber inside the tube. Then, the tube is heated so that the adhesive swells out of the recess to make the joint between the tube and the fiber. This method is used to assemble a fiber optic Fabry-Perot interferometer. This interferometer can be used as a sensor for the measurement of a number of physical parameters.