Patents by Inventor Sylvain E. Ouimet

Sylvain E. Ouimet has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flip chip assembly with connected component
    Patent number: 10211174
    Abstract: A flip chip assembly is disclosed that includes a die with die circuitry and a plurality of electrical contacts electrically connected to the die circuitry. A substrate includes electrical contacts that are juxtaposed with and electrically connected to corresponding die electrical contacts. A passive component is disposed between the die and the substrate, and includes a dielectric disposed between a first electrode and a second electrode. The first electrode is electrically connected to a first of the die electrical contacts and a corresponding substrate electrical contact, and the second electrode is electrically connected to a second of the die electrical contacts and a corresponding substrate electrical contact.
    Type: Grant
    Filed: January 3, 2017
    Date of Patent: February 19, 2019
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Jean Audet, Luc G. Guerin, Richard Langlois, Stephan L. Martel, Sylvain E. Ouimet
  • Flip chip assembly with connected component
    Patent number: 9984988
    Abstract: A flip chip assembly is disclosed that includes a die with die circuitry and a plurality of electrical contacts electrically connected to the die circuitry. A substrate includes electrical contacts that are juxtaposed with and electrically connected to corresponding die electrical contacts. A passive component is disposed between the die and the substrate, and includes a dielectric disposed between a first electrode and a second electrode. The first electrode is electrically connected to a first of the die electrical contacts and a corresponding substrate electrical contact, and the second electrode is electrically connected to a second of the die electrical contacts and a corresponding substrate electrical contact.
    Type: Grant
    Filed: January 3, 2017
    Date of Patent: May 29, 2018
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Jean Audet, Luc G. Guerin, Richard Langlois, Stephan L. Martel, Sylvain E. Ouimet
  • FLIP CHIP ASSEMBLY WITH CONNECTED COMPONENT
    Publication number: 20170170133
    Abstract: A flip chip assembly is disclosed that includes a die with die circuitry and a plurality of electrical contacts electrically connected to the die circuitry. A substrate includes electrical contacts that are juxtaposed with and electrically connected to corresponding die electrical contacts. A passive component is disposed between the die and the substrate, and includes a dielectric disposed between a first electrode and a second electrode. The first electrode is electrically connected to a first of the die electrical contacts and a corresponding substrate electrical contact, and the second electrode is electrically connected to a second of the die electrical contacts and a corresponding substrate electrical contact.
    Type: Application
    Filed: January 3, 2017
    Publication date: June 15, 2017
    Inventors: JEAN AUDET, LUC G. GUERIN, RICHARD LANGLOIS, STEPHAN L. MARTEL, SYLVAIN E. OUIMET
  • FLIP CHIP ASSEMBLY WITH CONNECTED COMPONENT
    Publication number: 20170170134
    Abstract: A flip chip assembly is disclosed that includes a die with die circuitry and a plurality of electrical contacts electrically connected to the die circuitry. A substrate includes electrical contacts that are juxtaposed with and electrically connected to corresponding die electrical contacts. A passive component is disposed between the die and the substrate, and includes a dielectric disposed between a first electrode and a second electrode. The first electrode is electrically connected to a first of the die electrical contacts and a corresponding substrate electrical contact, and the second electrode is electrically connected to a second of the die electrical contacts and a corresponding substrate electrical contact.
    Type: Application
    Filed: January 3, 2017
    Publication date: June 15, 2017
    Inventors: JEAN AUDET, LUC G. GUERIN, RICHARD LANGLOIS, STEPHAN L. MARTEL, SYLVAIN E. OUIMET
  • Flip chip assembly with connected component
    Patent number: 9553079
    Abstract: A flip chip assembly is disclosed that includes a die with die circuitry and a plurality of electrical contacts electrically connected to the die circuitry. A substrate includes electrical contacts that are juxtaposed with and electrically connected to corresponding die electrical contacts. A passive component is disposed between the die and the substrate, and includes a dielectric disposed between a first electrode and a second electrode. The first electrode is electrically connected to a first of the die electrical contacts and a corresponding substrate electrical contact, and the second electrode is electrically connected to a second of the die electrical contacts and a corresponding substrate electrical contact.
    Type: Grant
    Filed: December 15, 2015
    Date of Patent: January 24, 2017
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Jean Audet, Luc G. Guerin, Richard Langlois, Stephan L. Martel, Sylvain E. Ouimet