Abstract: A method for reducing the number of wire-bond loop heights which are required in comparison with a total quantity of power and signal rings employed in low profile wire-bond integrated circuit packages. There are also provided low profile wire-bond packages which are produced in accordance with the method pursuant to the invention.

Abstract: A method for reducing the number of wire-bond loop heights which are required in comparison with a total quantity of power and signal rings employed in low profile wire-bond integrated circuit packages. There are also provided low profile wire-bond packages which are produced in accordance with the method pursuant to the invention.

Abstract: A method for reducing the number of wire-bond loop heights which are required in comparison with a total quantity of power and signal rings employed in low profile wire-bond integrated circuit packages. There are also provided low profile wire-bond packages which are produced in accordance with the method pursuant to the invention.

Abstract: A method for forming a wirebond connection to an integrated circuit structure includes forming an insulative structure overlaying a corrosion susceptible metal wiring within the integrated circuit structure, defining a via through the insulative structure above a portion of the corrosion susceptible metal without exposing the portion of the corrosion susceptible metal, and attaching a wirebond material to the portion of the corrosion susceptible metal. The attaching process includes a preliminary process of exposing the portion of the corrosion susceptible metal. The attaching completely covers the portion of the corrosion susceptible metal.

Abstract: A method for reducing the number of wire-bond loop heights which are required in comparison with a total quantity of power and signal rings employed in low profile wire-bond integrated circuit packages. There are also provided low profile wire-bond packages which are produced in accordance with the method pursuant to the invention.

Abstract: A method for reducing the number of wire-bond loop heights which are required in comparison with a total quantity of power and signal rings employed in low profile wire-bond integrated circuit packages. There are also provided low profile wire-bond packages which are produced in accordance with the method pursuant to the invention.

Abstract: Parallel optical coupling apparatus for coupling a connector attached to one end of a parallel optical cable to a receiver or transmitter array. A parallel fiber optic assembly includes a receiver or transmitter array subassembly that houses a parallel optical coupler for transferring optical signals from an array of sources (e.g., lasers) in the assembly to the connector, or from the connector to an array of receiving elements in the assembly. A connector shell is provided that properly aligns the connector with respect to the optical coupler array.

Abstract: Parallel optical coupling apparatus for coupling a connector attached to one end of a parallel optical cable to a receiver or transmitter array. A parallel fiber optic assembly includes a receiver or transmitter array subassembly that houses a parallel optical coupler for transferring optical signals from an array of sources (e.g., lasers) in the assembly to the connector, or from the connector to an array of receiving elements in the assembly. A connector shell is provided that properly aligns the connector with respect to the optical coupler array.