Abstract: A device for measuring interface shape of an optical element, including at least one low-coherence light source, at least one optical sensor, an interferometric device illuminated by the light source or and configured for shaping at least one measurement beam and at least two reference beams, directing one measurement beam to the element to pass through the interfaces, and directing the light from at least two interfaces to the sensor or sensors, each sensor globally configured for detecting at least two interference signals resulting respectively from interferences between the measurement beam reflected by one of the at least two interfaces and one of the reference beams; the measurement device also including a positioner for positioning a coherence area at the level of each interface; and a digital processor for producing, from the interference signals, an item of information of the shape of each interface according to a field of view.

Abstract: A method for measuring interfaces of an optical element, forming part of a plurality of similar elements including at least one reference optical element, the method implemented by a device, the method including: relative positioning of each reference optical element and the measurement beam, to allow a measurement of interfaces of each reference optical element; acquisition of a reference image, of each reference element; positioning of the measured optical element to allow acquisition of a measurement image, of the optical element to be measured; determining a difference of position in a field of view of the measured element with respect to each reference optical element, based on the reference and measurement images; adjusting the position of the measured optical element in the field of view to cancel the difference of position; and measuring the interfaces of the measured optical element by the measurement beam.

Abstract: A method for measuring interfaces of an optical element, forming part of a plurality of similar elements including at least one reference optical element, the method implemented by a device, the method including: relative positioning of each reference optical element and the measurement beam, to allow a measurement of interfaces of each reference optical element; acquisition of a reference image, of each reference element; positioning of the measured optical element to allow acquisition of a measurement image, of the optical element to be measured; determining a difference of position in a field of view of the measured element with respect to each reference optical element, based on the reference and measurement images; adjusting the position of the measured optical element in the field of view to cancel the difference of position; and measuring the interfaces of the measured optical element by the measurement beam.

Abstract: A device for positioning an integrated circuit wafer includes: a base, called upper, and a base, called lower, arranged at a distance from one another in a direction, called vertical, so as to leave a free space between the bases; a support, provided to be mobile between the upper and lower bases, and including a location for receiving the wafer to be inspected; at least one first means apparatus for positioning the support in the vertical direction against, or by cooperation with, the upper base; and at least one second means apparatus for positioning the support in the vertical direction against, or by cooperation with, the lower base. Also provided is an inspection equipment for an integrated circuit wafer implementing such a positioning device.

Abstract: A device for positioning an integrated circuit wafer includes: a base, called upper, and a base, called lower, arranged at a distance from one another in a direction, called vertical, so as to leave a free space between the bases; a support, provided to be mobile between the upper and lower bases, and including a location for receiving the wafer to be inspected; at least one first means apparatus for positioning the support in the vertical direction against, or by cooperation with, the upper base; and at least one second means apparatus for positioning the support in the vertical direction against, or by cooperation with, the lower base. Also provided is an inspection equipment for an integrated circuit wafer implementing such a positioning device.

Abstract: The present invention relates to a method for characterizing an object of interest (1) by interacting with a measuring interface (2), comprising steps for (i) acquiring a spatial distribution of measurements representative of the distance (3) between the object of interest (1) and a plurality of measuring points of the measuring interface (2), (ii) determining an estimated position of the object of interest (1) relative to the measuring interface (2), and (iii) determining at least one additional characteristic of the object of interest from among a dimensional characteristic and an angular positioning characteristic (8, 23) relative to the measuring interface (2). The invention also relates to an interface device and an apparatus implementing the method.