Patents by Inventor Sylvain Tetreault

Sylvain Tetreault has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250089174
    Abstract: In-situ fabrication of tamper-respondent sensors with random security circuit patterns is provided. The method includes establishing a random security circuit pattern for fabricating a security circuit of a tamper-respondent sensor to enclose, at least in part, one or more components within a secure volume. The establishing includes generating a trace pattern extending once through nodes of a plurality of nodes dispersed within an area of the tamper-respondent sensor, and randomly modifying the trace pattern to produce a randomly modified trace pattern with a desired randomization index relative to a specified randomization threshold, and providing the randomly modified trace pattern as a random security circuit pattern. Further, the method includes initiating fabricating of the tamper-respondent sensor in-situ on a surface of an enclosure to facilitate defining the secure volume, with the fabricating using the random security circuit pattern.
    Type: Application
    Filed: September 8, 2023
    Publication date: March 13, 2025
    Inventors: Hongqing ZHANG, Arthur J. HIGBY, David J. LEWISON, James BUSBY, Jay A. BUNT, Levi CAMPBELL, Philipp K. BUCHLING REGO, Shidong LI, Sylvain TETREAULT, Yu LUO
  • Patent number: 10798816
    Abstract: Tamper-respondent assemblies are provided which include an enclosure with an edge surface, and a tamper-respondent sensor. The tamper-respondent sensor covers, at least in part, the edge surface and an inner surface of the enclosure. The sensor includes at least one tamper-detect circuit. The tamper-detect circuit(s) includes a conductive trace(s) in a tamper-detect pattern. The tamper-respondent sensor includes exposed regions and unexposed regions of the conductive trace(s) at the edge surface of the enclosure to facilitate an adhesive directly contacting the at least one conductive trace in the exposed regions.
    Type: Grant
    Filed: January 20, 2020
    Date of Patent: October 6, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: James A. Busby, Arthur J. Higby, David C. Long, Michael J. Fisher, Russell A. Budd, Michel Turgeon, Sylvain Tetreault
  • Patent number: 10595401
    Abstract: Tamper-respondent assemblies are provided which include an enclosure assembly mounted to a circuit board and enclosing an electronic component(s) within a secure volume. The enclosure assembly includes an enclosure with an edge surface coupled to the circuit board, and a tamper-respondent sensor. The tamper-respondent sensor covers the edge surface and an inner surface of the enclosure. The sensor includes multiple layers, and at least one tamper-detect circuit. The tamper-detect circuit(s) includes a conductive trace(s) in a tamper-detect pattern covered, at least in part, by at least one layer of the multiple layers. The at least one layer is partially removed to provide exposed regions and unexposed regions of the conductive trace(s) at the edge surface of the enclosure. The conductive trace(s) is contacted where exposed by an adhesive securing the sensor to the circuit board. A monitor circuit monitors the tamper-detect circuit(s) for a tamper event.
    Type: Grant
    Filed: May 29, 2019
    Date of Patent: March 17, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: James A. Busby, Arthur J. Higby, David C. Long, Michael J. Fisher, Russell A. Budd, Michel Turgeon, Sylvain Tetreault