Patents by Inventor Sylvain Vienot

Sylvain Vienot has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11254514
    Abstract: A feeding assembly and a method of feeding components comprising a track along which components can be moved, said track comprising a sloped surface and a ledge, wherein said sloped surface slopes in a direction perpendicular to the direction which the components move along the track so that the components maintain a tilted orientation as they move along the track, a pickup platform comprising a pocket which can receive components from said track, and a pivot on which the pickup platform can be selectively rotated between a first position and second position. In the first position, the pocket is aligned with the track and the pocket is parallel with the sloped surface of the track, so that a component can move from the track into the pocket of the pickup platform. In the second position the pocket is in a horizontal orientation.
    Type: Grant
    Filed: May 14, 2019
    Date of Patent: February 22, 2022
    Assignee: ISMECA SEMICONDUCTOR HOLDING SA
    Inventors: Sylvain Vienot, Valerio Osler, Philippe Roy
  • Publication number: 20210147156
    Abstract: According to the present invention there is provided a feeding assembly comprising, a track along which components can be moved, said track comprising a sloped surface and a ledge, wherein said sloped surface slopes in a direction which is perpendicular to the direction which the components move along the track so that the components are maintained in a tilted orientation as they move along the track; a pickup platform which comprises a pocket which can receive components from said track; wherein the feeding assembly further comprise a pivot on which the pickup platform can be selectively rotated between a first position and second position, wherein in its first position the pocket is aligned with the track and the pocket is parallel with the sloped surface of the track, so that a component can move from the track into the pocket of the pickup platform, and in its second position the pocket is in a horizontal orientation.
    Type: Application
    Filed: May 14, 2019
    Publication date: May 20, 2021
    Applicant: Ismeca Semiconductor Holding SA
    Inventors: Sylvain VIENOT, Valerio OSLER, Philippe ROY
  • Publication number: 20200238335
    Abstract: A feeder assembly includes a hopper which can receive components to be fed and a sorting means which comprises at least a first mesh and a second mesh having different sized openings. The size of the openings in one of the meshes is larger than the size of the openings in the other mesh, so that the mesh with the larger sized openings can separate good components from malformed components and particles which are larger than the size of a good component, and the mesh with the smaller sized openings can separate good components from malformed components and particles which are smaller than the size of a good component. A first track can receive good components from the sorting means. The first track vibrates so as to move good components along the first track. One or more baffles positioned along the first track move good components into a predefined orientation. Also disclosed area method of feeding and a component handling assembly.
    Type: Application
    Filed: May 2, 2018
    Publication date: July 30, 2020
    Applicant: ISMECA SEMICONDUCTOR HOLDING SA
    Inventors: Philippe VIVERGE, Valerio OSLER, Sylvain VIENOT
  • Patent number: 9523710
    Abstract: A nest includes a fix part, and a movable part, wherein the fix part and movable part are configured to cooperate so as to define a pocket which can receive at least a part of an electrical component, wherein the movable part is moveable between a first position and a second position, wherein in the first position the pocket is open so that at least part of the electrical component can be moved into the pocket, and in the second position the pocket is closed so that the at least part of the electrical component positioned in the pocket is secured within the pocket, wherein the nest further includes a biasing means which is arranged to bias the movable part towards its second position. There is further provided a nest assembly, a component handling assembly, and a table that includes the nest.
    Type: Grant
    Filed: December 5, 2012
    Date of Patent: December 20, 2016
    Assignee: ISMECA SEMICONDUCTOR HOLDING SA
    Inventors: Sylvain Vienot, Phillipe Viverge, Massimo Scarpella, Philippe Roy
  • Patent number: 9521793
    Abstract: A method for filling a carrier tape (10) with electronic components (12) and for removing and replacing defective electronic components (13) from the carrier tape, comprising the steps of: at a filling station (1), loading an electronic component in a pocket (11) of the carrier tape (10), moving said carrier tape (10) forward, automatically detecting that said electronic component which is defective, moving said carrier tape backward, and unloading the defective electronic component (13) from the carrier tape (10), at said filling station (1), filling said packet with a new electronic component.
    Type: Grant
    Filed: June 3, 2011
    Date of Patent: December 13, 2016
    Assignee: ISMECA SEMICONDUCTOR HOLDINGS SA
    Inventors: Sylvain Vienot, Franco Craveiro, Philippe Roy
  • Publication number: 20160327429
    Abstract: A testing device for measuring the light characteristics of an electronic component includes an inlet at one end at which an electronic component can be presented for testing. A shutter is located at the inlet and is moveable between a first open position in which an electronic component can be received into the inlet, and a second closed position in which the shutter can overlay at least the majority of a nest on which said electronic component is supported, so that the shutter prevents light emitted by the electronic component from being diverted away from the testing device. The shutter includes at least one sliding door that can be slid to move the shutter into its first and second open positions. The at least one sliding door includes a cut out portion that defines said opening when the shutter is in its second closed position.
    Type: Application
    Filed: August 20, 2014
    Publication date: November 10, 2016
    Applicant: ISMECA SEMICONDUCTOR HOLDING SA
    Inventor: Sylvain VIENOT
  • Publication number: 20140375323
    Abstract: A nest (1) comprising, a fix part (3), and a movable part (5), wherein the fix (part 3) and movable part (5) are configured to cooperate so as to define a (pocket 7) which can receive at least a part of an electrical component (25), wherein the movable part (5) is moveable between a first position and a second position, wherein in the first position the pocket (7) is open so that at least part of the electrical component can be moved into the pocket (7), and in the second position the pocket (7) is closed so that the at least part of the electrical component (25) positioned in the pocket is secured within the pocket, wherein the nest (1) further comprises a biasing means (9) which is arranged to bias the movable part (5) towards its second position. There is further provided a nest assembly, a component handling assembly, and a table comprising said nest.
    Type: Application
    Filed: December 5, 2012
    Publication date: December 25, 2014
    Inventors: Sylvain Vienot, Phillipe Viverge, Massimo Scarpella, Philippe Roy
  • Publication number: 20110231002
    Abstract: A method for filling a carrier tape (10) with electronic components (12) and for removing and replacing defective electronic components (13) from the carrier tape, comprising the steps of: at a filling station (1), loading an electronic component in a pocket (11) of the carrier tape (10), moving said carrier tape (10) forward, automatically detecting that said electronic component which is defective, moving said carrier tape backward, and unloading the defective electronic component (13) from the carrier tape (10), at said filling station (1), filling said packet with a new electronic component.
    Type: Application
    Filed: June 3, 2011
    Publication date: September 22, 2011
    Applicant: ISMECA SEMICONDUCTOR HOLDINGS SA
    Inventors: Sylvain Vienot, Franco Craveiro, Philippe Roy