Patents by Inventor Sylvia Baumann Winter

Sylvia Baumann Winter has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Crack stop barrier and method of manufacturing thereof
    Patent number: 10438903
    Abstract: A semiconductor device includes a chip, a first kerf adjacent the chip and having a first main direction, a second kerf adjacent the chip and having a second main direction. A kerf junction is formed by the first kerf and the second kerf. A crack stop barrier is located along a first portion of a perimeter of the kerf junction.
    Type: Grant
    Filed: September 11, 2017
    Date of Patent: October 8, 2019
    Assignee: Infineon Technologies AG
    Inventor: Sylvia Baumann Winter
  • Crack Stop Barrier and Method of Manufacturing Thereof
    Publication number: 20180012848
    Abstract: A semiconductor device includes a chip, a first kerf adjacent the chip and having a first main direction, a second kerf adjacent the chip and having a second main direction. A kerf junction is formed by the first kerf and the second kerf. A crack stop barrier is located along a first portion of a perimeter of the kerf junction.
    Type: Application
    Filed: September 11, 2017
    Publication date: January 11, 2018
    Inventor: Sylvia Baumann Winter
  • Crack stop barrier and method of manufacturing thereof
    Patent number: 9793224
    Abstract: A wafer is disclosed. The wafer comprises a plurality of chips and a plurality of kerfs. A kerf of the plurality of kerfs separates one chip from another chip. The kerf comprises a crack stop barrier.
    Type: Grant
    Filed: December 18, 2015
    Date of Patent: October 17, 2017
    Assignee: Infineon Technologies AG
    Inventor: Sylvia Baumann Winter
  • Crack Stop Barrier and Method of Manufacturing Thereof
    Publication number: 20160104682
    Abstract: A wafer is disclosed. The wafer comprises a plurality of chips and a plurality of kerfs. A kerf of the plurality of kerfs separates one chip from another chip. The kerf comprises a crack stop barrier.
    Type: Application
    Filed: December 18, 2015
    Publication date: April 14, 2016
    Inventor: Sylvia Baumann Winter
  • Crack stop barrier and method of manufacturing thereof
    Patent number: 9245801
    Abstract: A wafer is disclosed. The wafer comprises a plurality of chips and a plurality of kerfs. A kerf of the plurality of kerfs separates one chip from another chip. The kerf comprises a crack stop barrier.
    Type: Grant
    Filed: February 19, 2014
    Date of Patent: January 26, 2016
    Assignee: Infineon Technologies AG
    Inventor: Sylvia Baumann Winter
  • Crack Stop Barrier and Method of Manufacturing Thereof
    Publication number: 20140167225
    Abstract: A wafer is disclosed. The wafer comprises a plurality of chips and a plurality of kerfs. A kerf of the plurality of kerfs separates one chip from another chip. The kerf comprises a crack stop barrier.
    Type: Application
    Filed: February 19, 2014
    Publication date: June 19, 2014
    Applicant: Infineon Technologies AG
    Inventor: Sylvia Baumann Winter
  • Crack stop barrier and method of manufacturing thereof
    Patent number: 8692392
    Abstract: A wafer is disclosed. The wafer comprises a plurality of chips and a plurality of kerfs. A kerf of the plurality of kerfs separates one chip from another chip. The kerf comprises a crack stop barrier.
    Type: Grant
    Filed: October 5, 2010
    Date of Patent: April 8, 2014
    Assignee: Infineon Technologies AG
    Inventor: Sylvia Baumann Winter
  • Crack Stop Barrier and Method of Manufacturing Thereof
    Publication number: 20120080673
    Abstract: A wafer is disclosed. The wafer comprises a plurality of chips and a plurality of kerfs. A kerf of the plurality of kerfs separates one chip from another chip. The kerf comprises a crack stop barrier.
    Type: Application
    Filed: October 5, 2010
    Publication date: April 5, 2012
    Inventor: Sylvia Baumann Winter