Abstract: An orthotic device comprises a flexible support structure comprising at least one surface for contacting a body part of a user, a plurality of pressure sensors configured for coupling to a microcontroller, and a plurality of displacement regions. Each region defines a portion of said flexible support structure, wherein each portion includes at least one sensor disposed on or below the at least one surface and at least one electrically deformable unit. Each unit comprises at least one electroactive material and is configured for coupling to the microcontroller and to a power source. The device is dynamically adjustable to change its shape and support properties, when an electrical voltage is applied to the electroactive material under the control of a microcontroller.

Abstract: An orthotic device comprises a flexible support structure comprising at least one surface for contacting a body part of a user, a plurality of pressure sensors configured for coupling to a microcontroller, and a plurality of displacement regions. Each region defines a portion of said flexible support structure, wherein each portion includes at least one sensor disposed on or below the at least one surface and at least one electrically deformable unit. Each unit comprises at least one electroactive material and is configured for coupling to the microcontroller and to a power source. The device is dynamically adjustable to change its shape and support properties, when an electrical voltage is applied to the electroactive material under the control of a microcontroller.

Abstract: An orthotic device comprises a flexible support structure comprising at least one surface for contacting a body part of a user, a plurality of pressure sensors configured for coupling to a microcontroller, and a plurality of displacement regions. Each region defines a portion of said flexible support structure, wherein each portion includes at least one sensor disposed on or below the at least one surface and at least one electrically deformable unit. Each unit comprises at least one electroactive material and is configured for coupling to the microcontroller and to a power source. The device is dynamically adjustable to change its shape and support properties, when an electrical voltage is applied to the electroactive material under the control of a microcontroller.

Abstract: An orthotic device comprises a flexible support structure comprising at least one surface for contacting a body part of a user, a plurality of pressure sensors configured for coupling to a microcontroller, and a plurality of displacement regions. Each region defines a portion of said flexible support structure, wherein each portion includes at least one sensor disposed on or below the at least one surface and at least one electrically deformable unit. Each unit comprises at least one electroactive material and is configured for coupling to the microcontroller and to a power source. The device is dynamically adjustable to change its shape and support properties, when an electrical voltage is applied to the electroactive material under the control of a microcontroller.

Abstract: Embodiments provide a system and a method to control the gas ambient in a reticle frame system. The reticle frame system can include a first cross structure including a pellicle, a second cross structure substantially parallel to the first cross structure, a first side structure, and a second side structure. The second cross structure can include a reticle. An inlet frame can be coupled in one of the first and second side structures. At least one inlet passage can be configured through the inlet frame. An outlet frame can be coupled in the other of the first and second side structures. At least one outlet passage can be configured through the outlet frame. A frame filter can be positioned to cover one end of the outlet passage.

Abstract: A method for fabricating a phase shift photomask (10) includes providing a photomask (12) having a substantially opaque layer (16) on a surface (14) of a substantially transparent substrate (18). The opaque layer (14) includes a removed portion to define a light transmitting pattern (20) of the photomask (12). The method also includes depositing an implant (22) in a portion of the substrate (18). The implanted portion (24) of the substrate (18) includes an etch rate different than an etch rate of an unimplanted portion (32) of the substrate (18). The method includes initiating an etch of the substrate (18) corresponding to the light transmitting pattern (20) and monitoring a rate of the etch. The method further includes terminating the etch in response to detecting a change in the rate of the etch.

Abstract: One embodiment of the instant invention is a process chamber for heating a semiconductor wafer, the process chamber comprising: heating elements (elements 104 of FIG. 2a) for providing heating energy; means for holding (means 112 of FIG. 2a) the semiconductor wafer; and shutters situated between the heating elements and the means for holding the semiconductor wafer, the shutters (shutters 108 of FIGS. 2a and 2b and shutters of FIGS. 2c and 2d for blocking the heating energy from getting to the semiconductor wafer when the shutters are in a closed position and for directing the heating energy to the semiconductor wafer when in an open position.