Patents by Inventor Sylvia Ehrler

Sylvia Ehrler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for providing an electrical connection and printed circuit board
    Patent number: 11219119
    Abstract: Method for providing an electrical connection, comprising connecting a first cable to a first conducting structure on a printed circuit board, connecting a second cable to a second conducting structure on the printed circuit board, comparing a propagation delay of a first signal path comprising the first cable and the first conducting structure on the printed circuit board, and a propagation delay of a second signal path comprising the second cable and the second conducting structure on the printed circuit board; and removing conductive material of the first conducting structure and/or of the second conducting structure, in order to modify an electrical length of the first conducting structure and/or of the second conducting structure, to obtain a first conducting path and a second conducting path, in dependence on a result of the comparison, in order to reduce a difference of the propagation delays between the first signal path and the second signal path.
    Type: Grant
    Filed: April 9, 2020
    Date of Patent: January 4, 2022
    Assignee: Advantest Corporation
    Inventor: Sylvia Ehrler
  • METHOD FOR PROVIDING AN ELECTRICAL CONNECTION AND PRINTED CIRCUIT BOARD
    Publication number: 20200288564
    Abstract: Method for providing an electrical connection, comprising connecting a first cable to a first conducting structure on a printed circuit board, connecting a second cable to a second conducting structure on the printed circuit board, comparing a propagation delay of a first signal path comprising the first cable and the first conducting structure on the printed circuit board, and a propagation delay of a second signal path comprising the second cable and the second conducting structure on the printed circuit board; and removing conductive material of the first conducting structure and/or of the second conducting structure, in order to modify an electrical length of the first conducting structure and/or of the second conducting structure, to obtain a first conducting path and a second conducting path, in dependence on a result of the comparison, in order to reduce a difference of the propagation delays between the first signal path and the second signal path.
    Type: Application
    Filed: April 9, 2020
    Publication date: September 10, 2020
    Inventor: Sylvia EHRLER
  • Electrical testing apparatus for testing an electrical test sample and electrical testing method
    Patent number: 9116175
    Abstract: An electrical testing apparatus for testing an electrical test sample. The apparatus includes a conductor substrate which is electrically connected via a contact spacing converter to a test head. The conductor substrate is mechanically connected to a first stiffening device and is thereby stiffened. At least one spacer which penetrates the conductor substrate is mechanically connected to the contact spacing converter and is held on the first stiffening device via at least one tilt adjusting arrangement.
    Type: Grant
    Filed: January 24, 2012
    Date of Patent: August 25, 2015
    Assignee: FEINMETALL GMBH
    Inventors: Gunther Boehm, Berislav Kopilas, Sylvia Ehrler, Michael Holocher
  • Electrical testing apparatus with a tilt adjusting arrangement for testing an electrical test sample and electrical testing method
    Patent number: 8217675
    Abstract: An electrical testing apparatus for testing an electrical test sample. The apparatus includes a conductor substrate (12) which is electrically connected via a contact spacing converter (7) to a test head (2). The conductor substrate is mechanically connected to a first stiffening device (26) and is thereby stiffened. At least one spacer (30) which penetrates the conductor substrate (12) is mechanically connected to the contact spacing converter (7) and is held on the first stiffening device (26) via at least one tilt adjusting arrangement (34).
    Type: Grant
    Filed: July 21, 2009
    Date of Patent: July 10, 2012
    Assignee: Feinmetall GmbH
    Inventors: Gunther Boehm, Berislav Kopilas, Sylvia Ehrler, Michael Holocher
  • ELECTRICAL TESTING APPARATUS FOR TESTING AN ELECTRICAL TEST SAMPLE AND ELECTRICAL TESTING METHOD
    Publication number: 20120119774
    Abstract: An electrical testing apparatus for testing an electrical test sample. The apparatus includes a conductor substrate which is electrically connected via a contact spacing converter to a test head. The conductor substrate is mechanically connected to a first stiffening device and is thereby stiffened. At least one spacer which penetrates the conductor substrate is mechanically connected to the contact spacing converter and is held on the first stiffening device via at least one tilt adjusting arrangement.
    Type: Application
    Filed: January 24, 2012
    Publication date: May 17, 2012
    Inventors: Gunther BOEHM, Berislav KOPILAS, Sylvia EHRLER, Michael HOLOCHER
  • ELECTRICAL TESTING APPARATUS FOR TESTING AN ELECTRICAL TEST SAMPLE AND ELECTRICAL TESTING METHOD
    Publication number: 20100019788
    Abstract: An electrical testing apparatus for testing an electrical test sample. The apparatus includes a conductor substrate (12) which is electrically connected via a contact spacing converter (7) to a test head (2). The conductor substrate is mechanically connected to a first stiffening device (26) and is thereby stiffened. At least one spacer (30) which penetrates the conductor substrate (12) is mechanically connected to the contact spacing converter (7) and is held on the first stiffening device (26) via at least one tilt adjusting arrangement (34).
    Type: Application
    Filed: July 21, 2009
    Publication date: January 28, 2010
    Applicant: FEINMETALL GmbH
    Inventors: Gunther Boehm, Berislav Kopilas, Sylvia Ehrler, Michael Holocher