Abstract: Disclosed are semiconductor devices and methods for manufacturing them. An example device may include a III-nitride stack having a front side surface and a back side surface. The III-nitride stack may be formed of at least a first layer and a second layer, between which a heterojunction may be formed, such that a two-dimensional electron gas layer is formed in the second layer. A source electrode, a drain electrode, and a gate electrode positioned between the source and drain electrodes may be formed on the front side surface, and an insulation layer may be formed over the electrodes on the front side surface. A carrier substrate may be attached to the insulation layer. An electrically conductive back plate may be formed on the back side surface. The back plate may directly face the source electrode and the gate electrode, but not the drain electrode.

Abstract: Disclosed are semiconductor devices and methods for manufacturing them. An example device may include a III-nitride stack having a front side surface and a back side surface. The III-nitride stack may be formed of at least a first layer and a second layer, between which a heterojunction may be formed, such that a two-dimensional electron gas layer is formed in the second layer. A source electrode, a drain electrode, and a gate electrode positioned between the source and drain electrodes may be formed on the front side surface, and an insulation layer may be formed over the electrodes on the front side surface. A carrier substrate may be attached to the insulation layer. An electrically conductive back plate may be formed on the back side surface. The back plate may directly face the source electrode and the gate electrode, but not the drain electrode.