Abstract: The invention relates to a method and device for thermal simulation of electronic systems involving breaking down the system into parts being in a single material and represented as a detailed model, to form a plurality of detailed models each including at least a mesh, a heat admittance system, a heat transfer interface, a connection interface, a power multi-source interface, and a temperature measurement interface; reducing each of the detailed models into a compact model by controlling the maximum of a heat flow frequency; interpolating nodes of the heat transfer interface, connection interface, power multi-source interface, or temperature measurement interface of at least one of the detailed models and the coupling of at least two of the compact models into a macromodel; and reducing the macromodel to form a compact and flexible thermal model.

Abstract: The invention relates to a method for thermal simulation of an electronic circuit, including: a) the breaking down of the circuit into components, each represented as a first model including at least one meshing of the component, a matrix of heat conductances and a matrix of heat susceptances, b) the definition of at least one interface area of each model, c) the formation of a reduced model of each model, d) the connection of the reduced models of different components in order to form a reduced model of the circuit, e) the simulation of the thermal behavior of the circuit by means of this reduced model of the circuit.