Abstract: An installation for calibration of a stress gauge for an external bearing block of a turbomachine roller bearing, the bearing block including a radially internal roller bearing race. The installation includes a support table on which the bearing block is attached; an internal roller bearing ring mounted coaxial with the bearing block; a drive shaft driving the ring. The installation also includes a device for applying an axial stress to the bearing block including a support drum on which the internal ring is removably fixed and a connection with the device for applying the axial stress.

Abstract: An installation for calibration of a stress gauge for an external bearing block of a turbomachine roller bearing, the bearing block including a radially internal roller bearing race. The installation includes a support table on which the bearing block is attached; an internal roller bearing ring mounted coaxial with the bearing block; a drive shaft driving the ring. The installation also includes a device for applying an axial stress to the bearing block including a support drum on which the internal ring is removably fixed and a connection with the device for applying the axial stress.

Abstract: Chip location identification using dummy solder bead(s) is disclosed. A structure may include an integrated circuit (IC) chip including a plurality of solder beads for electrically coupling the IC chip to other structure, and a chip location identifier including at least one dummy solder bead on the IC chip, the chip location identifier representing a unique location of the IC chip in a wafer prior to dicing. The structure allows location tracking of an IC chip within a wafer without any additional processing, space, or mask levels. The structure can also be evaluated (visually or electrically) at the packaging level.