Abstract: A solder composition is applied to the pins of an electronic component. The pins of the component are brought into contact with solder at a soldering station having a bath exposed to a controlled atmosphere of low oxygen content maintained in a hood enclosing at least the surface of the bath. The controlled atmosphere is comprised of at least one neutral gas and a gaseous silicon hydride whose content is between 50.times.10.sup.-6 and 2.times.10.sup.-3 of the volume of the controlled atmosphere. The controlled atmosphere is produced:a) by introducing into the hood the neutral gas to bring the residual oxygen content to less than 200 ppm, thenb) by introducing into the hood the neutral gas and the silicon hydride with a content greater than four times the residual oxygen content in the controlled atmosphere, at the end of step a).

Abstract: In a method of dry process fluxing at least one surface of a metallic article, the surface to be fluxed is treated with a plasma at atmospheric pressure of a gaseous mixture comprising hydrogen and optionally at least one inert gas. The invention also concerns an apparatus, particularly for practicing the process, as well as a process for soldering or plating.

Abstract: The invention relates to a process for preparing interconnection substrates of hybrid circuits, comprising effecting on a support the deposition of a thick layer of ink or paste based on a non-noble metal, such as copper or other material having a "copper compatible" formulation, by carrying out in succession a preliminary drying for eliminating solvents at a temperature on the order of 100.degree. C. to 150.degree. C., a firing comprising:a) a temperature rise incorporating a stage for eliminating polymer resins,b) a sintering step at a temperature on the order of 600.degree. C. to 1000.degree. C., andc) a timed cooling,the firing being carried out under a substantially inert gas atmosphere (nitrogen and/or argon and/or helium), the atmosphere of the stage for eliminating the polymer resins having a content of water vapor lower than 15,000 ppm, preferably between 1,000 and 10,000 ppm, while the atmosphere for sintering at high temperature has a content of water vapor in any case lower than 1,000 ppm.

Abstract: A device for providing a non-oxidizing atmosphere above a soldering bath in a vat of a machine for wave soldering, includes a hooding assembly closing the vat, an inner space and a conveyor for electronic circuits extending through the inner space. The inner space is separated from the surrounding atmosphere through seals disposed along the path of the circuits. There is structure for providing and maintaining a non-oxidizing atmosphere in the inner space, for example an inert gas or a mixture of inert and reducing gas.

Abstract: The process comprises, after deposition of a layer of raw ink on a support having a high thermal dissipation, of the aluminium nitride type, effecting a preliminary drying of this ink at a temperature on the order of 100.degree. C. to 150.degree. C., then a firing comprising:(a) a temperature rise including a polymer resin eliminating stage,(b) a sintering plateau at a temperature on the order of 600.degree. C. to 1000.degree. C., and(c) a timed cooling,wherein the atmosphere of the polymer resin eliminating stage has an oxygen content of between 100 ppm and 5000 ppm, while the oxygen contents of the high temperature sintering atmosphere and of the cooling atmosphere must be lower than about 10 ppm.