Patents by Inventor Sylvie Vervoort

Sylvie Vervoort has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220389138
    Abstract: A process to prepare an alpha composition comprising a first ethylene/alpha-olefin/interpolymer fraction and a second ethylene/alpha-olefin/interpolymer fraction; said process comprising polymerizing, in one reactor, a reaction mixture, comprising ethylene and an alpha-olefin, a biphenyl phenol metal complex selected from Structure 1, as described herein, and a biphenyl phenol metal complex selected from Structure 2, as described herein; and alpha compositions prepared therefrom.
    Type: Application
    Filed: December 16, 2020
    Publication date: December 8, 2022
    Inventors: Johnathan E. DeLorbe, Daniela Ferrari, Thomas Wesley Karjala, Jr., Sylvie Vervoort, Jeffrey C. Munro, Lisa S. Madenjian
  • Publication number: 20220381664
    Abstract: A rheology system includes a rheometer including a lower plate and an upper plate, a manipulator including an arm, a loading end effector, a cleaning end effector, and a controller communicatively coupled to the rheometer and the manipulator, the controller including a processor and a computer readable and executable instruction set, which when executed, causes the processor to direct the manipulator to couple the loading end effector to the arm, direct the manipulator engage a specimen with the loading end effector, direct the manipulator to position the specimen on the lower plate of the rheometer, direct the upper plate to engage the specimen between the upper plate and the lower plate, direct the manipulator to couple the cleaning end effector to the arm, and direct the manipulator to engage the lower plate with the cleaning end effector.
    Type: Application
    Filed: August 26, 2020
    Publication date: December 1, 2022
    Applicant: Dow Global Technologies LLC
    Inventors: Sanjay C. Solanki, Christopher M. Thurber, Jin Wang, Donald L. McCarty, II, Sylvie Vervoort, Peter Hermann Roland Sandkuehler, Cornelis F.J. Den Doelder, Paul A. OConnell, John E. Lund, Colleen M. Southwell, Eric L. Marchbanks, Marc M.J. Dees, Kurt A. Koppi, Birgit Braun
  • Publication number: 20220251352
    Abstract: Embodiments of this disclosure include polymer blends comprising at least 90% by weight low density polyethylene (LDPE) polymer; and from 1% to 10% by weight ethylene acrylate copolymer. The ethylene acrylate copolymer is the polymerized reaction product of: at least 50% by wt. ethylene, based on the total weight of the monomers present in the ethylene acrylate copolymer; from 2% to 40% by wt. alkyl acrylate, based on the total weight of the monomers present in the ethylene acrylate copolymer; and from 0 to 20 wt. % of monocarboxylic acid monomer, based on the total weight of the monomers present in the ethylene acrylate copolymer.
    Type: Application
    Filed: July 24, 2020
    Publication date: August 11, 2022
    Applicant: Dow Global Technologies LLC
    Inventors: Eva-Maria KUPSCH, Yifan DONG, Sylvie VERVOORT
  • Patent number: 10414857
    Abstract: A curable resin system comprising 1) an epoxy component having a polyglycidyl ether of a polyphenol having an epoxy equivalent weight of up to about 190; and 2) a hardener component comprising polyethylene tetraamine mixture; wherein the epoxy component has a viscosity of less than 9000 mPa·s at 25° C.
    Type: Grant
    Filed: March 17, 2015
    Date of Patent: September 17, 2019
    Assignee: Dow Global Technologies LLC
    Inventors: Timothy A. Morley, Rainer Koeniger, Sergio Grunder, Sylvie Vervoort, Nebojsa Jelic
  • Publication number: 20160376398
    Abstract: A curable resin system comprising 1) an epoxy component having a polyglycidyl ether of a polyphenol having an epoxy equivalent weight of up to about 190; and 2) a hardener component comprising polyethylene tetraamine mixture; wherein the epoxy component has a viscosity of less than 9000 mPa·s at 25° C.
    Type: Application
    Filed: March 17, 2015
    Publication date: December 29, 2016
    Applicants: Dow Europe GmbH, Dow Benelux B.V.
    Inventors: Timothy A. Morley, Rainer Koeniger, Sergio Grunder, Sylvie Vervoort, Nebojsa Jelic
  • Patent number: 9475928
    Abstract: The present disclosure provides a composition comprising: a) a polypropylene; b) a polyolefin elastomer; and c) a block composite. The polyolefin elastomer has an I10/I2 from greater than 7.5 to 15.0. The composition may optionally include a filler.
    Type: Grant
    Filed: December 31, 2013
    Date of Patent: October 25, 2016
    Assignee: Dow Global Technologies LLC
    Inventors: Yi Jin, Xuming X. Chen, Kim L. Walton, Gary R. Marchand, Jeffrey D. Weinhold, Sylvie Vervoort
  • Patent number: 9321880
    Abstract: A two-component curable epoxy resin system is disclosed. The resin system includes an epoxy resin component containing at least 80% by weight of a polyglycidyl ether of a polyphenol. The system also includes an hardener mixture containing mainly polyethylene tetraamines. The system include triethylene diamine in specific amounts as a catalyst. The system has beneficial curing characteristics that make it useful for producing fiber-reinforced composites in a resin transfer molding process.
    Type: Grant
    Filed: November 11, 2013
    Date of Patent: April 26, 2016
    Assignee: Dow Global Technologies LLC
    Inventors: Sergio Grunder, Rainer Koeniger, Timothy A. Morley, Nebjosa Jelic, Sylvie Vervoort, Martin Reimers, Peter Cate
  • Publication number: 20150203628
    Abstract: A two-component curable epoxy resin system is disclosed. The resin system includes an epoxy resin component containing at least 80% by weight of a polyglycidyl ether of a polyphenol. The system also includes an hardener mixture containing mainly polyethylene tetraamines. The system include triethylene diamine in specific amounts as a catalyst. The system has beneficial curing characteristics that make it useful for producing fiber-reinforced composites in a resin transfer molding process.
    Type: Application
    Filed: November 11, 2011
    Publication date: July 23, 2015
    Applicant: Dow Global Technologies LLC
    Inventors: Sergio Grunder, Rainer Koeniger, Timothy A. Morley, Nebjosa Jelic, Sylvie Vervoort, Martin Reimers, Peter Cate
  • Patent number: 9066425
    Abstract: Method of manufacturing patterned conductor is provided, comprising: providing a conductivized substrate, wherein the conductivized substrate comprises a substrate and an electrically conductive layer; providing an electrically conductive layer etchant; providing a spinning material; providing a masking fiber solvent; forming a plurality of masking fibers and depositing the plurality of masking fibers onto the electrically conductive layer; exposing the electrically conductive layer to the electrically conductive layer etchant, wherein the electrically conductive layer that is uncovered by the plurality of masking fibers is removed from the substrate, leaving an interconnected conductive network on the substrate covered by the plurality of masking fibers; and, exposing the plurality of masking fibers to the masking fiber solvent, wherein the plurality of masking fibers are removed to uncover the interconnected conductive network on the substrate.
    Type: Grant
    Filed: April 1, 2013
    Date of Patent: June 23, 2015
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Jake Joo, Jerome Claracq, Sylvie Vervoort, Mubasher Bashir, Peter Trefonas, Garo Khanarian, Kathleen O'Connell
  • Publication number: 20140290979
    Abstract: Method of manufacturing patterned conductor is provided, comprising: providing a conductivised substrate, wherein the conductivised substrate comprises a substrate and an electrically conductive layer; providing an electrically conductive layer etchant; providing a spinning material; providing a masking fiber solvent; forming a plurality of masking fibers and depositing the plurality of masking fibers onto the electrically conductive layer; exposing the electrically conductive layer to the electrically conductive layer etchant, wherein the electrically conductive layer that is uncovered by the plurality of masking fibers is removed from the substrate, leaving an interconnected conductive network on the substrate covered by the plurality of masking fibers; and, exposing the plurality of masking fibers to the masking fiber solvent, wherein the plurality of masking fibers are removed to uncover the interconnected conductive network on the substrate.
    Type: Application
    Filed: April 1, 2013
    Publication date: October 2, 2014
    Inventors: Jake Joo, Jerome Claracq, Sylvie Vervoort, Mubasher Bashir, Peter Trefonas, Garo Khanarian, Kathleen O'Connell